SC3: 0.35 µm CMOS Standard Cell

• Up to 2 M logic gates and 2 M bits of RAM
• Excellent performance:
  • 980 MHz maximum toggle rate on clocked flip-flops
  • High speed operation: 67 ps delay for a 2-input NAND gate (FO=2; L=0 mm; VDD=3.3 V)
  • Low power operation: 86 ps delay for a 2-input NAND gate (FO=2; L=0 mm; VDD=2.5 V)
  • 6ns clock-to-out performance (C_L = 35 pF)
• Mixed voltage operation:
  • Split power supply bussing between core and pads
  • 3.3 V or 2.5 V core operation
  • 2.5 V, 3.3 V, 5 V I/O
  • 5 V tolerant I/O cells
• Operating temperature range -55 to 150°C
• Cost driven architecture:
  • 2 or 3 level metal interconnect provides lowest device cost for gates and pads required
• Extensive library for quick design:
  • Complete core cell and I/O library
  • IP functions include processors, peripherals and datapath synthesizers
• Extensive memory support:
  • Synchronous single, 2-port and dual port up to 16 Kx8 bits
  • Dedicated BIST ports
  • Memory compilers optimized for speed, density, and low power
  • Synchronous ROM compiler from 64x1 to 16 Kx32 bits
• FPGA conversion specific memory features:
  • Output register mode, shift register mode, FIFO mode
  • Xilinx read before write
  • Xilinx no change mode
  • Altera MRAM size

• Extensive I/O cell options:
  • User-configurable pad cells with predefined components
  • 1 to 24 mA per single I/O cell
  • Custom configurations for I/O drive up to 96 mA
  • Standard and slew rate limited availability
  • PCI 33 MHz and 66 MHz compliant
  • CMOS, TTL, LVCMOS, LVTTL, PCI 33/66 levels
• Extensive DFT methodology:
  • Scan-chain insertion and reordering
  • Built-in self test (BIST) for memory blocks
  • Automatic test program generation (ATPG)
  • JTAG boundary scan insertion
• JTAG boundary scan macro support
• Extensive packaging capabilities:
  • 0.65 mm to 1.27 mm pitch BGAs
  • CSPs, QFPs, CQFPs, TQFPs, PLCCs, LCCs, JLCCs
  • Stacked packages with flash
  • Burn-in capability as required
• Full operating voltage range from 2.25 V to 3.6 V
• ESD protection > 2k V
• Latchup > 100 mA
• Power dissipation: 0.84 μW/MHz/gate (FO=1; VDD=3.3 V)
• Power dissipation: 0.36 μW/MHz/gate (FO=1; VDD=2.5 V)

SC3 standard cell technology targets high volume digital ASIC products. The low device cost accommodates designs requiring significant on-board memory, data path logic or IP blocks.

SC3 wafers are produced in ON Semiconductor's domestic wafer fab. In addition ON Semiconductor offers a complete on-shore flow including design, mask generation, silicon, packaging, and test complete with ITAR and NOFORN processing to support government and military programs. SC3 has extensive flight heritage.

SC3 also supports a wide range of applications in the industrial, communications, computing & peripherals and medical markets.

Mid-Range ASIC Design: SC3 provides a cost effective solution for mid-range applications with gate counts up to 2 million gates and up to 2 million bits of memory. Combined with support for a rich family of I/O standards, the ON Semiconductor RTL sign-off and netlist hand-off flows provide quick and seamless access for SC3 designs.

FPGA Conversion: SC3 provides an ideal platform to cost reduce or replace obsolete PLD and FPGA devices, or even advanced FPGAs with suitable performance requirements. SC3 provides extensive support for FPGA memory and timing generator features, including live at power up (LAPU capability).

Support for EOL Products: ON Semiconductor's FPGA-to-ASIC and ASIC-to-ASIC conversion capabilities allow SC3 to be a cost-effective, long-term solution for end-of-life products.

Process Upgrade: ON Semiconductor ASICs designed in 1.25 µm, 1.0 µm, 0.8 µm, 0.6 µm, 0.5 µm processes, and any legacy 3.3 V core technology can be easily upgraded to the SC3 family. The ON Semiconductor ASIC library provides a common netlist design base.

Adding Custom Blocks: ON Semiconductor specializes in combining digital and analog functions in custom ASICs. Analog functions include ADCs and DACs, op-amps and comparators, EMI/RFI filters, AC-DC and DC-DC controllers and regulators, drivers, thermal management, voltage and current management, and digital potentiometers.