Our industry leading Treo analog and mixed signal platform accelerates custom application specific integrated circuit (ASIC) development through reusable IP blocks, proven analog front ends, safety features, and tightly integrated power and interface options. It combines compute, power, sensing, and communications IP on a modular platform to meet aerospace, defense and security demands for performance, reliability, and assurance.
onsemi partners with customers to confidently turn mission concepts into silicon faster. We deliver assured supply, and are capable of supporting export controlled and Trusted, secure flows. We offer prototyping and shuttle runs to accelerate development cycles, enabling customers to validate designs with confidence.
Custom Foundry Technologies:
Treo: modular, SoC like architecture with silicon proven IP accelerates development cycle and brings compute, power, interfaces and communications onto one die to reduce weight, increase reliability, and enable platform speed and reuse.
Treo BCD 65nm Readout Integrated Circuit (ROIC): enables high voltage and low power mixed signal CMOS ROIC designs to deliver precise signal capturing and processing in focal plane arrays for real time awareness in challenging environments.
- A combination of conventional analog and digital pixel ROIC architectures enables development of efficient detector arrays and smaller pixel sizes.
- Up to nine layers of copper metal stack, high-density metal-insulator-metal (MiM) capacitors and through-passivation vias (TPVs): enable superior signal integrity, compact layout efficiency, and enhanced vertical interconnectivity.
- World-class wafer die stitching: enables seamless integration of large die ROIC designs.
- PDK and cryogenic models: enable critical applications such as deep space imaging along with quantum computing and low-noise scientific instrumentation.
