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Manufacturing Processes

ON Semiconductor has a broad portfolio of manufacturing processes. Supplemental front-end services include probe and custom short flow wafer processing; and supplemental back-end services include backgrind, backmetal, packaging, test, and logistics.

Process Name Min Drawn Poly (µ) No. Metal Layers Wafer Size (in) Operating Voltage (Vgs) Metal 1 Pitch NVM Linear Cap HV Devices (Vds) N-Ch DMOS P-Ch DMOS Bi-polars Trans Char Other Devices
I4T 45V/70V 0.18 4-6 8 1.8/3.3 0.46 Yes MIM 45/70 Yes Yes No Salicide Resistors
ONC18 18V18V 0.18 4-6 8 5/18 0.46 Yes MIM 18 Yes Yes No Salicide Resistors
ONC18 5V30V 0.18 4-6 8 1.8/5 0.46 Yes MIM 30 Yes Yes No Salicide Resistors
ONC18G/MS 0.18 4-6 8 1.8/3.3 0.46 Yes MIM 15 Yes Yes No Salicide Resistors
ONC25 0.25 2-5 8 2.5/3.3/5 0.64 Yes MIM 5 No No Yes Salicide Misc.
ONBCD25 0.25 2-5 8 5/12 0.64 Yes MIM 40 Yes Yes Yes Salicide Misc.
C3/D3 0.35 3-5 8 3.3/5 1.10 Yes PIP 5 No No No Salicide Resistors
I3T25 0.35 3-5 8 3.3/12 1.00 Yes MIM 18 Yes Yes Yes Salicide Resistors
I3T50 0.35 3-5 6 & 8 3.3 1.00 Yes MIM 40 Yes Yes Yes Salicide Misc.
I3T80 0.35 3-5 6 & 8 3.3 1.00 Yes MIM 70 Yes Yes Yes Salicide Misc.
C5 0.6 2-3 8 5/12 1.50 Yes PIP 20 Yes Yes No Poly Misc.
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