P-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET -20V, -2.6A, 140mΩ

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Overview

Designed on an advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ661PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile (0.4 mm) and small (0.8x0.8 mm2) packaging, low gate charge, and low rDS(on).

  • Mobile Handsets
  • Battery Management
  • Load Switch
  • Battery Protection
  • Max rDS(on) = 140 mΩ at VGS = -4.5 V, ID = -2 A
  • Max rDS(on) = 182 mΩ at VGS = -2.5 V, ID = -1.5 A
  • Max rDS(on) = 231 mΩ at VGS = -1.8 V, ID = -1 A
  • Max rDS(on) = 315 mΩ at VGS = -1.5 V, ID = -1 A
  • Occupies only 0.64 mm2 of PCB area. Less than 16% of the area of 2 x 2 BGA
  • Ultra-thin package: less than 0.4 mm height when mounted to PCB
  • HBM ESD protection level > 2 kV (Note 3)
  • RoHS Compliant

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Product

Status

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Channel Polarity

Configuration

VGS Max (V)

VGS(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Reference Price

FDZ661PZ

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Lifetime

CAD Model

Pb

A

H

P

WLCSP-4

1

260

REEL

5000

N

-20

-

P-Channel

Single

8

-1.2

-2.6

1.3

182

140

12

6.3

416

$0.2391

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