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J-SERIES SIPM: Silicon Photomultiplier Sensors, J-Series (SiPM)

Datasheet: Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package
Rev. 6 (696kB)
Product Overview
»View Material Composition
» Product Change Notification
ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been optimized for high-performance timing applications, such as ToF-PET (time of flight positron emission tomography). Due to increased microcell density, J-Series sensors can achieve a photon detection efficiency (PDE) of 50% and with sensitivity extending down into the UV. They feature industry-leading low dark count rates of 50 kHz/mm2 and because the sensors are created using a high-volume CMOS silicon process they feature an exceptional breakdown voltage uniformity of ±250 mV.

J-Series sensors are available in 3 mm, 4 mm and 6 mm sizes packaged in a TSV chip scale package that is compatible with industry standard, lead-free, reflow soldering processes. J-Series sensors also feature ON Semiconductor's unique fast output for fast timing capability.

Features   Benefits
     
  • High-density microcells
  
  • Results in a 50% photon detection efficiency (PDE) at 420 nm
  • J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
  
  • Improved signal rise time and the microcell recovery time
  • Temperature stability of 21.5 mV/°C
  
  • Negates the need for active voltage control
  • Exceptional breakdown voltage uniformity of ±250 mV
  
  • Industry-leading uniformity
  • Available in a reflow solder compatible TSV chip-scale package
  
  • TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
  • Ultra-low dark count rates of 50 kHz/mm2 typical
    
  • Optimized for high-performance timing applications, such as ToF-PET
    
  • 3 mm, 4 mm and 6 mm sensor sizes
    
  • Bias voltage of <30 V
    
Applications
  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics
Technical Documentation & Design Resources
Application Notes (9) Package Drawings (3)
White Papers (1) Videos (1)
Data Sheets (1)  
Evaluation/Development Tool Information
Product Status Compliance Short Description Action
MICROFJ-SMA-30020-GEVB Active
MicroFJ-30020-TSV mounted onto a PCB with three SMA connectors (No active electronics)
MICROFJ-SMA-30035-GEVB Active
MicroFJ-30035-TSV mounted onto a PCB with three SMA connectors (No active electronics)
MICROFJ-SMA-40035-GEVB Active
MicroFJ-40035-TSV mounted onto a PCB with three SMA connectors (No active electronics)
MICROFJ-SMA-60035-GEVB Active
MicroFJ-60035-TSV mounted onto a PCB with three SMA connectors (No active electronics)
MICROFJ-SMTPA-30020-GEVB Active
MicroFJ-30020-TSV mounted on a pin adapter board
MICROFJ-SMTPA-30035-GEVB Active
MicroFJ-30035-TSV mounted on a pin adapter board
MICROFJ-SMTPA-60035-GEVB Active
MicroFJ-60035-TSV mounted on a pin adapter board
Availability & Samples
Specifications
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
MICROFJ-30020-TSV-TR Active
Pb-free
Halide free
J-SERIES SIPM, 3 mm, 20 µm, TSV ODCSP-8 570CS 3 260 Tape and Reel 3000 Contact Sales Office
MICROFJ-30020-TSV-TR1 Active
Pb-free
Halide free
J-SERIES SIPM, 3 mm, 20 µm, TSV ODCSP-8 570CS 4 260 Tape and Reel 1 Contact Sales Office
MICROFJ-30035-TSV-TR Active
Pb-free
Halide free
J-SERIES SIPM, 3 mm, 35 µm, TSV ODCSP-8 570CS 3 260 Tape and Reel 3000 Contact Sales Office
MICROFJ-30035-TSV-TR1 Active
Pb-free
Halide free
J-SERIES SIPM, 3 mm, 35 µm, TSV ODCSP-8 570CS 4 260 Tape and Reel 1 Contact Sales Office
MICROFJ-40035-TSV-TR Active
Pb-free
Halide free
J-SERIES SIPM, 4 mm, 35 µm, TSV ODCSP-16 570CN 3 260 Tape and Reel 3000 Contact Sales Office
MICROFJ-40035-TSV-TR1 Active
Pb-free
Halide free
J-SERIES SIPM, 4 mm, 35 µm, TSV ODCSP-16 570CN 4 260 Tape and Reel 1 Contact Sales Office
MICROFJ-60035-TSV-TR Active
Pb-free
Halide free
J-SERIES SIPM, 6 mm, 35 µm, TSV ODCSP-36 570CP 3 260 Tape and Reel 3000 Contact Sales Office
MICROFJ-60035-TSV-TR1 Active
Pb-free
Halide free
J-SERIES SIPM, 6 mm, 35 µm, TSV ODCSP-36 570CP 4 260 Tape and Reel 1 Contact Sales Office
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : 4 to 8
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : 4 to 8
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : 4 to 8
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : 4 to 8

Product
Description
Pricing ($/Unit)
Compliance
Status
Type
Array Format
Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
Package Type
MICROFJ-30020-TSV-TR  
 J-SERIES SIPM, 3 mm, 20 µm, TSV 
Pb
H
 Active   
Single
3 mm x 3 mm
20
420
38
50
ODCSP-8
MICROFJ-30020-TSV-TR1  
 J-SERIES SIPM, 3 mm, 20 µm, TSV 
Pb
H
 Active   
Single
3 mm x 3 mm
20
420
38
50
ODCSP-8
MICROFJ-30035-TSV-TR  
 J-SERIES SIPM, 3 mm, 35 µm, TSV 
Pb
H
 Active   
Single
3 mm x 3 mm
35
420
50
50
ODCSP-8
MICROFJ-30035-TSV-TR1  
 J-SERIES SIPM, 3 mm, 35 µm, TSV 
Pb
H
 Active   
Single
3 mm x 3 mm
35
420
50
50
ODCSP-8
MICROFJ-40035-TSV-TR  
 J-SERIES SIPM, 4 mm, 35 µm, TSV 
Pb
H
 Active   
Single
4 mm x 4 mm
35
420
50
50
ODCSP-16
MICROFJ-40035-TSV-TR1  
 J-SERIES SIPM, 4 mm, 35 µm, TSV 
Pb
H
 Active   
Single
4 mm x 4 mm
35
420
50
50
ODCSP-16
MICROFJ-60035-TSV-TR  
 J-SERIES SIPM, 6 mm, 35 µm, TSV 
Pb
H
 Active   
Single
6 mm x 6 mm
35
420
50
50
ODCSP-36
MICROFJ-60035-TSV-TR1  
 J-SERIES SIPM, 6 mm, 35 µm, TSV 
Pb
H
 Active   
Single
6 mm x 6 mm
35
420
50
50
ODCSP-36
Case Outlines
570CS    570CN    570CP   
Previously Viewed Products
Clear List

Associated Products
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