System-in-Package (SiP)

Wireless DSP SIP

System-in-Package options from ON Semiconductor enable greater system integration using advanced 3D packaging technology. Diverse technologies may be integrated
at the package level, leading to a reduced footprint. Using existing die products reduces development time, thereby allowing full-custom or semi-custom products to go to
market quicker

Typical SiP Die Components

  • Custom Analog Front End (AFE) ASIC incorporating existing analog and power management IP blocks, as well as custom designs
  • Platform MCU based on ARM Cortex M0+/M3
  • Power MOSFETs for drivers, power regulation, or load switching
  • MEMs or 3rd party sensor
  • Additional Memory: SRAM, EEPROM, Flash, etc.

SiP Options

  • Wirebonded in stacked or side-by-side configuration
  • Thru-silicon vias (TSVs)
  • Capability for three or more die in one package

Struix SiP Example


Reasons for Using a Mixed Signal
ASIC for Industrial Applications

Reasons for Using a Mixed Signal
ASIC for Medical Imaging

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