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FDZ371PZ: P-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET -20V, -3.7A, 75mΩ

Datasheet: FDZ371PZ-D.pdf
Rev. A (379kB)
Product Overview
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» Product Change Notification
Designed on an advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ371PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Features
 
  • Max rDS(on) = 75 mΩ at VGS = -4.5 V, ID = -2.0 A
  • Max rDS(on) = 90 mΩ at VGS = -2.5 V, ID = -1.5 A
  • Max rDS(on) = 110 mΩ at VGS = -1.8 V, ID = -1.0 A
  • Max rDS(on) = 150 mΩ at VGS = -1.5 V, ID = -1.0 A
  • Occupies only 1.0 mm2 of PCB area. Less than 30% of the area of 2 x 2 BGA
  • Ultra-thin package: less than 0.4 mm height when mounted to PCB
  • HBM ESD protection level > 4.4 kV (Note 3)
  • RoHS Compliant
Applications
  • This product is general usage and suitable for many different applications.
  • Battery Management
  • Load Switch
  • Battery Protection
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
FDZ371PZ Lifetime
Pb-free
Halide free
FDZ371PZ WLCSP-4 567PS 1 260 Tape and Reel 5000 $0.3692
Market Leadtime (weeks) : Contact Factory
Case Outlines
567PS   
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