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FDZ193P: P-Channel 1.7V PowerTrench® WL-CSP MOSFET -20V, -1A, 90mΩ

Datasheet: FDZ193P-D.pdf
Rev. A (424kB)
Product Overview
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Designed on an advanced 1.7V PowerTrench® process with state of the art "low pitch" WLCSP packaging process, the FDZ193P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Features
 
  • Max rDS(on) = 90mΩ at VGS = -4.5V, ID = -1A
  • Max rDS(on) = 130mΩ at VGS = -2.5V, ID = -1A
  • Max rDS(on) = 300mΩ at VGS = -1.7V, ID = -1A
  • Occupies only 1.5 mm² of PCB area Less than 50% of the area of 2 x 2 BGA
  • Ultra-thin package: less than 0.65 mm height when mounted to PCB
  • RoHS Compliant
Applications
  • This product is general usage and suitable for many different applications.
  • Battery Management
  • Load Switch
  • Battery Protection
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
FDZ193P Last Shipments
Pb-free
Halide free
FDZ193P WLCSP-6 567PW 1 260 Tape and Reel 5000  
Market Leadtime (weeks) : Contact Factory
ON Semiconductor   (2020-09-02 00:00) : 10,000
Case Outlines
567PW   
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