Integrated N-Channel PowerTrench®MOSFET and Schottky Diode 30 V, 2.9 A, 123 mΩ

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Overview

This device is designed specifically as a single package solution for a boost topology in cellular handset and other ultra-portable applications. It features a MOSFET with low input capacitance, total gate charge and onstate resistance, and an independently connected schottky diode with low forward voltage and reverse leakage current to maximize boost efficiency.
The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to switching and linear mode applications.

  • This product is general usage and suitable for many different applications.
  • 2.9 A, 30 V
  • RDS(ON) = 123 mΩ @ VGS = 4.5 V
  • RDS(ON) = 140 mΩ @ VGS = 3.0 V
  • RDS(ON) = 163 mΩ @ VGS = 2.5
  • VF < 0.46 V @ 500mA
  • Low profile – 0.8 mm maximum – in the new package MicroFET 2x2 mm
  • HBM ESD protection level = 1.8kV typical (Note 3)
  • RoHS Compliant

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CAD Models

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Channel Polarity

Configuration

VGS Max (V)

VGS(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Reference Price

FDFMA3N109

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Obsolete

CAD Model

Pb

A

H

P

WDFN-6

1

260

REEL

3000

N

30

123

N-Channel

with Schottky Diode

12

1.5

2.9

1.5

-

163

-

2.4

190

Price N/A

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