Integrated N-Channel PowerTrench® MOSFET and Schottky Diode 30 V, 1.8 A, 299 mΩ

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Overview

This device is designed specifically as a single package solution for a boost topology in cellular handset and other ultra-portable applications. It features a MOSFET with low input capacitance, total gate charge and on-state resistance. An independently connected schottky diode with low forward voltage and reverse leakage current to maximize boost efficiency.
The MicroFET 1.6x1.6 Thin package offers exceptional thermal performance for it's physical size and is well suited to switching and linear mode applications.

  • This product is general usage and suitable for many different applications.
  • Max rDS(on) = 299 mΩ at VGS = 4.5 V, ID = 1.6 A
  • Max rDS(on) = 410 mΩ at VGS = 2.5 V, ID = 1.3 A
  • Low profile: 0.55 mm maximum in the new package MicroFET 1.6x1.6 Thin
  • Free from halogenated compounds and antimony oxides
  • HBM ESD protection level > 1600V (Note3)
  • RoHS Compliant

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CAD Models

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Case Outline

MSL Type

MSL Temp (°C)

Container Type

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ON Target

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Channel Polarity

Configuration

VGS Max (V)

VGS(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Reference Price

FDFME3N311ZT

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Obsolete

CAD Model

Pb

A

H

P

UDFN-6

1

260

REEL

5000

N

30

299

N-Channel

with Schottky Diode

12

1.5

1.8

1.4

-

410

-

1

55

Price N/A

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