Military temperature range XPressArray®-II reduces NRE and unit cost and offers pin-for-pin FPGA replacement

PHOENIX, Ariz. – March 18, 2008 - ON Semiconductor (Nasdaq: ONNN), a global leader in power management solutions, has announced that XPressArray-II (XPA-II), a leading structured ASIC technology formerly offered by AMI Semiconductor, is now available for military specification operating temperatures (as the M-XPA-II Family).

By providing operation across the full military operating temperature range of -55°C - 125°C, XPA-II provides military and aerospace manufacturers with a cost-effective route to creating leading-edge ASICs and FPGA-to-ASIC conversions with minimum time to market. On-shore production and full ITAR compliance is assured through all stages of the development process, from initial design through to back-end packaging and test.

XPA-II is targeted at medium-density, high-speed 1.5V ASIC applications and FPGA-to-ASIC conversions. The structured ASIC family offers a true drop-in alternative for a variety of FPGAs, including Altera APEX-II and Stratix technologies and Xilinx Virtex-II solutions.

Based on a hybrid fabrication process, XPA-II combines advanced 0.15-micron TSMC process technology with programmable metal using ON Semiconductor’s own state-of-the-art manufacturing facilities. The result is an innovative next-generation technology platform that dramatically reduces development time for system-on-chip (SoC) applications while delivering significant NRE (non-recurring engineering costs) and unit cost savings.

Operating with system clock speeds up to 210MHz for 18x18 soft multipliers and local clocks up to 500MHz, XPA-II 0.15µm devices deliver high performance, low power ASIC solutions with densities to 4.8M ASIC gates. Configurable memory ranges from 258kbits to 4.8Mbits, increasing to 6.1Mbits with the addition of distributed configurable memory.

The XPA-II I/O technology includes fully configurable signal, core and I/O power supply pad locations and support for a wide range of I/O standards, including PCI, PCI-X, Mode 1 and Mode 2, GTL, HSTL, SSTL and LVPECL. The I/O technology also features a double data rate (DDR) memory interface and 1Gbps low-voltage differential signaling (LVDS). All of these features are available in a platform that supports power dissipation of just 55nW/MHz/gate, reducing total chip power consumption to less than 20 percent of a standard FPGA. High fault coverage is provided through integrated scan-test, memory BIST and JTAG support.

“XPressArray-II has become an established technology for allowing electronic equipment manufacturers to achieve better cost, performance and power specifications than FPGAs and quicker time to market than cell-based solutions,” states Dave Locke, ON Semiconductor mil/aero product manager. “Compatibility with the military operating temperature range extends these benefits to military and aerospace manufacturers and eliminates the risk and the cost associated with upscreening alternative solutions.”

For additional information about XPressArray-II, please contact your local sales representative at or at

About ON Semiconductor
With its global logistics network and strong product portfolio, ON Semiconductor (Nasdaq: ONNN) is a preferred supplier of efficient power solutions to customers in the power supply, automotive, communication, computer, consumer, medical, industrial, mobile phone, and military/aerospace markets. The company’s broad portfolio includes power, analog, DSP, mixed-signal, advance logic, clock management and standard component devices. Global corporate headquarters are located in Phoenix, Arizona. The company operates a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit

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onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein.

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