Rad Hard Space & Hi-Rel ASICs
ON Semiconductor offers Radiation Hardened by Design (RHBD) solutions critical for space and Hi-Rel applications. Available in the company’s 110 nm digital Application Specific Integrated Circuit (ASIC) processes, the design offering includes a novel flip-flop architecture called Self Restoring Logic (SRL). SRL remains hard to single event effects at high Linear Energy Transfer (LET) while operating up to 700 MHz, far exceeding the capability of legacy RHBD flip-flop architectures. A latch-up resistant Dual Port SRAM with on-board error correction code (ECC), hardened clock elements, high speed I/O cells and a single event latch up protection cell. These cells are compatible with the existing digital ASIC flows resulting in superior pricing, development spans and manufacturing cycle times. ON Semiconductor has a wide range of design solutions to mitigate radiation effects. Hardened IP and a proven commercial ASIC development flow combine to achieve results that meet the design and application needs of a wide range of applications. The company’s ASIC legacy spans five decades and includes thousands of design-from-spec, customer interactive, and FPGA conversion success stories. The addition of 110nm RHBD capabilities enables ON Semiconductor to expand our ASIC heritage and service the needs of existing and new customers.
ON Semiconductor is a leading supplier of System-on-Chip (SoC), Application Specific Integrated Circuit (ASIC), and other custom solutions, supporting a wide range of applications in the automotive, industrial, medical, and aerospace & defense markets. ON Semiconductor has designed and manufactured more than 5,000 custom integrated circuits over the last 50 years.
ON Semiconductor supports Foundry projects with program managers, Customer Service Resources, and product marketing managers, from design engineering, through prototypes, and into production. Foundry experts in Europe and USA enable direct factory technical communications to ensure successful reticle generation, process integration, test development, yield enhancement, and prototype delivery.
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