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Package Drawings for  Thermal Management (Show All)

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Document Title
Document ID/Size
Revision
Revision Date
48 LEAD LQFP, 7X7, 0.5P 932AA (69kB) A Nov, 2019
C/O FOR MICRO 10 PKG 846B (30.6kB) D
DFN8 2.0x2.0x0.9mm, 0.5p 506AA (43kB) F Oct, 2019
DFN8 3x3, 0.5P 506BJ (43kB) O Nov, 2019
LFCSP32, 5x5, 0.5P 932AE (44kB) A Nov, 2019
Micro8 Surface Mount 846A-02 (56kB) K Jul, 2020
No Case Outline NA-No-CaseOut (2.9kB)
QFN24, 4x4, 0.5P 485L-01 (47kB) B Nov, 2019
QSOP-16 492-01 (55kB) A Nov, 2019
QSOP24 NB 492B-01 (57kB) a Oct, 2019
SOIC-8 Narrow Body 751-07 (53kB) AK Oct, 2019
TDFN8, 2x3, 0.5P 511AK (43kB) B Oct, 2019
TSSOP24 7.8x4.4, 0.65P 948H-01 (50kB) B Nov, 2019
UDFN6 2x2, 0.65P 517DR (58kB) O Nov, 2019
UDFN8, 2x3, 0.5P, Extended Pad 517AZ (44kB) A Nov, 2019
WDFN10, 3x3x0.5P 522AA (45kB) A Nov, 2019
WDFN8 2x1.8, 0.5P 511BU (46kB) O May, 2019
WDFN8 2x2, 0.5P 511AT (46kB) O Nov, 2019
WLCSP6, 1.1888x0.788x0.625 567YQ (48kB) O
WLCSP6, 1.355x0.845 567JR (42kB) A Dec, 2019
WLCSP8, 1.155x1.655 567DH (41kB) O May, 2019
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