onsemi Launches MOSFETs With Innovative Top-Cool Packaging

2022年11月17日

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顶部冷却简化设计并降低成本,实现小巧紧凑的电源方案

2022年11月17日 —领先于智能电源和智能感知技术的安森美(onsemi,美国纳斯达克股票代号:ON),宣布推出新系列MOSFET器件,采用创新的顶部冷却,帮助设计人员解决具挑战的汽车应用,特别是电机控制和DC-DC转换。

新的Top Cool器件采用TCPAK57封装,尺寸仅5mm x 7mm,在顶部有一个16.5 mm2的热焊盘,可以将热量直接散发到散热器上,而不是通过传统的印刷电路板(以下简称“PCB”)散热。采用TCPAK57封装能充分使用PCB的两面,减少PCB发热,从而提高功率密度。新设计的可靠性更高从而增加整个系统的使用寿命。

topcool

安森美副总裁兼汽车电源方案总经理Fabio Necco说:“冷却是高功率设计的最大挑战之一,成功解决这个问题对于减小尺寸和重量至关重要,这在现代汽车设计中也是关键的考虑因素。我们的新型Top Cool MOSFET不仅表现出卓越的电气效率,而且消除了PCB中的热路径,从而显著简化设计,减小尺寸并降低成本。”

这些器件提供高功率应用所需的电气效率,RDS(ON) 值低至1mΩ。而且栅极电荷(Qg) 低 (65 nC),从而降低高速开关应用中的损耗。

安森美利用其在封装方面的深厚专知,提供业内最高功率密度方案。首发的TCPAK57产品组合包括40V、60V和80V。这所有器件都能在175°C的结温(Tj)下工作,并符合AEC-Q101车规认证和生产件批准程序(PPAP)。再加上其鸥翼式封装,支持焊点检查和实现卓越的板级可靠性,非常适合于要求严苛的汽车应用。目标应用是高/中功率电机控制,如电动助力转向和油泵。

安森美现在提供这些新器件的样品,计划于2023年1月开始全面量产。请联系我们的销售办事处。

请访问我们的网站以了解 Top Cool 封装单 N 沟道功率 MOSFET 的更多信息。

About onsemi

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. onsemi offers a highly differentiated and innovative product portfolio, delivering intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way to creating a safer, cleaner, and smarter world. onsemi is recognized as a Fortune 500® company and included in the S&P 500® index. Learn more about onsemi at www.onsemi.com.

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onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein.

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