Material Composition

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5  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Plating   Die   Wire Bond - Au   Wire Bond - Cu   TOTAL 
Metal Hydroxide
[%]
Boron zinc hydroxide oxide
[%]
Zinc Monoxide (ZnO)
[%]
2,4,6-triamino-s-triazincompd.withs-triazine-triol
[%]
Ortho Cresol Novolac Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Nickel (Ni)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 138265-88-0 1314-13-2 37640-57-6 29690-82-2 7631-86-9 1333-86-4 60676-86-0 29690-82-2 9003-35-4 n/a 7440-22-4 7440-02-0 7439-89-6 7440-50-8 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a 7440-50-8 n/a n/a
2N7002KX 2N7002K Active  Y   Download xls Download xml Download xml Download xml     3.00   0.50   3.00      80.00   1.00      8.00   4.50   6.0610   2.00   36.30   50.20   11.50   2.3710   100.00   0.2060   100.00   0.0480         100.00   0.0090   8.6950 
2N7002K 2N7002KT1G Active  Y   Download xls Download xml Download xml Download xml     3.00   0.50   3.00      80.00   1.00      8.00   4.50   4.9000      36.30   50.20   13.50   2.9200   100.00   0.1400   100.00   0.0500         100.00   0.0100   8.0200 
2N7002K 2N7002KT3G Obsolete  Y           No data available
2N7002K 2N7002KT7G Active  Y   Download xls Download xml Download xml Download xml     3.00   0.50   3.00      80.00   1.00      8.00   4.50   4.9000      36.30   50.20   13.50   2.9200   100.00   0.1400   100.00   0.0500         100.00   0.0100   8.0200 
2N7002KW 2N7002KW Active  Y   Download xls Download xml Download xml Download xml  3.50            8.00      0.50   80.00      8.00   3.6850   2.32   40.03   57.65      1.2940   100.00   0.2270   100.00   0.2310   100.00   0.0150         5.4520 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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