Semiconductor Components Group and TelCom Semiconductor, Inc. Achieve Milestone in Alternate Source Agreement

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Hong Kong, China -- June 25, 1999 -- The joint venture between Semiconductor Components Group (SCG) and TelCom Semiconductor, Inc. has yielded the first phase of analog products targeted for power and thermal management applications. This collaboration heralds a string of power and thermal management products, in multiple phases over the next few quarters, which will strengthen, expand and complement both companies' product lines.

SCG is introducing two devices: the MC7660, a high performance, high frequency Charge Pump DC-to-DC Converter that is pin compatible to the industry standard ICL7660 and the MAX809/810, a pair of cost effective system supervisory circuits targeted to all systems with microprocessors and microcontrollers.

TelCom Semiconductor is launching its series of unique monolithic, very high voltage, off-line switching regulator circuits -- TC33369 to TC33374 -- that include multiple on-chip functions, which allow implementation of off-line power converters using few external components.

This significant milestone follows the alternate source alliance announcement earlier this year, where each company agreed to augment its product line with products from the other company, allowing each to offer customers broader and more complete system solutions.

These product introductions enable Semiconductor Components Group to accelerate entry in the low voltage power management market to better address the portable communication segments. Likewise, TelCom Semiconductor's product release supports the adoption of SWITCHMODE(tm) power supply controllers in Very High Technology at customers and allows them to offer complete power management solutions that range from offline all the way to local regulation.

"Today's announcement reinforces SCG's strategy of providing the best systems solutions for our customers and maintaining our leadership position in the industry," commented Steve Hanson, President and General Manager of Semiconductor Components Group. "It also enables us to acquire a strong position in thermal management, a strong growth area in the Portable Computing and Portable Communication segments."

Phil Drayer, President and CEO of TelCom Semiconductor added, "I believe the addition of these high voltage switchers gives TelCom the broadest range of power management solutions in the industry. Combined with our strength in thermal management solutions, TelCom is well poised for continued success."

SCG's MC7660 is an 8-pin SOIC charge pump voltage converter that converts a +1.5V to a +10V input to a corresponding -1.5V to -10V output, very efficiently and simply, using only two low cost capacitors. This device saves on system cost, board space, size and EMI, and can be used in battery operated applications such as cellular phones, pagers, portable instrumentation devices and display modules.

The MAX809/810 each monitor the voltage across the microprocessor to ensure that the microprocessor works under a stabilized voltage. They require no external components and are available in SOT-23 surface mount packages. They can be used in general-purpose digital applications that require monitoring of Vcc.

TelCom Semiconductor's new regulator series, types TC33369 through TC33374, incorporate both a BiCMOS controller and a high-voltage SENSEFET(tm) power switch circuit on the same chip, used to drive the primary side of a transformer in flyback mode applications.

Because these highly integrated units offer exceptional functionality, they will find use in off-line AC-DC, high voltage DC-DC applications such as Office Automation, Consumer and Industrial products making possible a reduction of the overall power supply part count, smaller PCB area, and reduced system component cost. In essence, the TC33369 through TC33374 series offers design simplicity for small form factor power supplies, with availability in TO-220 5-lead and DIP-8 packages.

Contact Semiconductor Components Group:
USA: Yinka Massally
Phone: +602 244-6398
Email: r1063@email.sps.mot.com

Asia: Anthony Lai
Phone: +1 852 2666-8129
Email: rhg126@email.sps.mot.com

Europe: Geert Devuyst
Phone: +1 33 5-6119-9488
Email: r29591@email.sps.mot.com

Contact TelCom Semiconductor, Inc
USA: Naz Amirsoleymani
Phone: +650 968-9241 Ext. 213
Email: naza@telcom-semi.com

Asia: Samuel Leung
Phone: +1 852 2350-7380
Email: samuell@telcom-semi.com

Europe: Siegmar Hausberger
Phone: +1 49 8-9895-6500
Email: sh_telcom@csi.com

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