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ON Semiconductor to Demonstrate Latest Connectivity and Sensing Solutions at the International Internet of Things Exhibition  Chinese

Innovations address growing number of applications in smart homes & buildings, personal IoT, industrial and medical

SHENZHEN, China – July 24, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will showcase its wide range of Internet of Things (IoT)-enabled solutions at the International Internet of Things Exhibition to be held July 29 - 31 in Shenzhen, China. The company capitalizes on the leading trade show in Asia to demonstrate and discuss its latest IoT solutions utilizing connectivity and sensing for applications including smart home and building, personal IoT, asset monitoring, industrial, and medical.

The Smart Home and Building zone at the company’s booth will feature multiple demonstrations including connectivity using Bluetooth® Low Energy (BLE), Wi-Fi and Zigbee™ to provide low power, reliable control of lighting in both industrial and residential scenarios. Sensing demonstrations in this area will feature image sensors from ON Semiconductor that provide ultra-low-power solutions to designers working on applications such as smart video doorbells. Devices like the AR0237 provide advanced imaging performance including the ability to capture both visible and infra-red (IR) images for depth sensing, and the sensitivity in varying light conditions required for 3D imaging for intelligent access control and smart video security.

Personal IoT and Asset Monitoring are rapidly growing and exciting areas with almost limitless applications. In this zone, BLE- based solutions that utilize the company’s industry-leading RSL10 System on Chip (RSL10 SoC) will be demonstrated for applications such as asset monitoring and tracking, audio streaming and hearing aids. Other demonstrations for personal IoT include a M2M demo kit for Alibaba IoT cloud platform connectivity, an ultra-low power audio HMI solution, and a voice-triggered smart speaker using the LC823455 audio SoC.

In the Industrial demonstration area, the main feature will be a sensing solution for a machine vision based Intelligent Transportation System (ITS) that utilizes the XGS 12000 12.6 megapixel (MP) image sensor that provides high resolution image quality and uniformity. Its compatibility with standard 29 mm x 29 mm camera designs can help speed and simplify designs for customers.

ON Semiconductor will also showcase its innovative cloud-connected Strata Developer Studio™. Strata provides a seamless, personalized and secure environment in which to evaluate and design using ON Semiconductor products and solutions.

To see live demonstrations and for more innovative solutions relating to IoT design, visit ON Semiconductor’s booth 1A210-2, Hall 1 at the Shenzhen Convention & Exhibition Center.

Also, an ON Semiconductor expert will address International Internet of Things Sensor Forum with “Emerging Visual IoT Solutions” at 10:20 on July 29 in seminar room 2 in Hall 9.



About ON Semiconductor
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit https://www.onsemi.com.

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ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.

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