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온세미컨덕터, 자동차 트랙션 인버터 위한 새로운 전력 모듈 제품군 발표  Chinese French German Italian Japanese

CES 2020서 최신 VE-Trac™제품군 플랫폼이 적용된 디바이스 최초 공개… 강력한 용량과 확장된 공급망을 기반으로 업계 선도적인 전력 및 열성능 제공

2019년 12월 17일 – 에너지 효율 혁신을 주도하는 온세미컨덕터(Nasdaq: ON)은 고전압 자동차 트랙션 인버터를 위한 최신 VE-Trac™ 전력 모듈 제품군 디바이스 2종을 최초로 출시했다. 이 전력통합모듈(PIM) 2종은 동급 최강의 전력 및 열성능과 함께 급성장 중인 트랙션 인버터 시장에 확장성과 안정성을 제공한다.

VE-Trac 제품군에는 디스크리트(discrete) 전력 디바이스, 절연 게이트 드라이버, 확장된 모듈 솔루션 뿐만 아니라, 와이드밴드갭(WBG) 디바이스 등이 포함된다. 이를 통해, 성능을 한층 향상시키는 동시에 자동차 시스템 설계자들도 사용할 수 있도록 제품 포트폴리오를 확장할 계획이다.

새롭게 출시된 디바이스 2종은 배터리 전기차(BEV), 플러그인 하이브리드차(PHEV), 풀 하이브리드차(HEV) 등 모든 유형의 전기자동차의 메인 트랙션 인버터에 사용하기 적합한 디바이스다. 온세미컨덕터는 이 두 디바이스 출시와 함께, VE-Trac DualVE-Trac Direct등 두 개 트랙션 인버터 설계 플랫폼도 새롭게 선보인다.

VE-Trac Dual은 트랙션 애플리케이션이라는 콤팩트한 풋프린트에서 스택 및 확장 가능한 양면 냉각(Dual Side Cool, DSC) 하프 브릿지 모듈 제품군이 될 것이다. VE-Trac Dual은 최소한의 기구 재설계로 필요한 80kW에서 300kW 범위의 트랙션 인버터 애플리케이션용 플랫폼 솔루션이 될 수 있다. 최초로 출시된 VE-Trac Dual 디바이스는 NVG800A75L4DSC다. 이 모듈은 750V 800A 수준으로, 기존 경쟁 제품 대비 두 배 강력한 성능을 구현한다. 또한 고효율 양면 냉각기술을 채택해, 시장을 선도하는 열성능을 달성했다.

NVG800A75L4DSC는 AQG-324인증 모듈로, 스마트 IGBT가 내장되어 있어 전류 감지 및 온도 과열 감지기능이 보다 빠르게 반응하며, 전반적으로 기존보다 강력한 솔루션을 제공한다. 모듈에 와이어 연결이 없을 경우 모듈의 수명은 두 배로 늘어난다. 향후 몇 개월 사이에 고전압을 비롯해 기존의 다양한 전력 옵션이 제공되는 VE-Trac Dual 플랫폼 디바이스가 추가적으로 출시돼 새롭게 등장하는 다양한 애플리케이션에 사용될 예정이다.

한편, VE-Track Direct 플랫폼은 뛰어난 열성능을 구현하는 직접 냉각 기능 등 동급 최강의 성능 및 장점을 다수 제공한다. VE-Trac Direct 플랫폼에서 첫번째로 출시되는 제품은 AQG-324인증 모듈인 NVH820S75L4SPB다. 이 디바이스는 자동차 OEM 제조업체 및 시스템 제공업체들 사이에서 널리 인정받고 광범위하게 사용되고 있는 식스팩 구성(six-pack configuration)을 차용하고 있다. 식스팩 구성으로 최소한의 레이아웃 변동을 통해 멀티 소싱을 구현할 수 있다. 다양한 전력 수준에 맞는 제품으로 출시될 VE-Trac Direct 플랫폼은 다양한 차량 플랫폼과 애플리케이션에 맞춰 빠르고 간단하게 전력 수준을 조절할 수 있다.

VE-Trac Dual과 VE-Trac Direct 플랫폼 모두 최대 175°C의 접합 온도에서 연속 작동할 수 있어, 콤팩트한 모듈 솔루션 풋프린트 내에 더 많은 전력을 공급할 수 있다.

온세미컨덕터는 모든 유형의 전기 자동차가 빠르게 도입되고 있으며 전기자동차 시장도 급성장 하고 있다는 것을 미리 인식하고, 자사 제조능력과 통합 공급망에 강력한 투자를 해왔다. 이것은 곧 VE-Trac 제품군이 자동차 트랙션 인버터에 필요한 다양한 전압에 맞는 디바이스의 급증하는 수요를 충족시킬 수 있다는 것을 말한다.

온세미컨덕터 파워 솔루션 그룹 고전력 사업부 부사장 겸 총괄 매니저인 아시프 자콰니(Asif Jakwani)는 VE-Trac 제품군에서 최초 출시되는 디바이스인 VE-Trac Dual과 VE-Trac Direct 대해 “고도로 통합된 디바이스와 전반적인 VE-Trac 프로그램은 당면 과제를 해결하고 전기 파워트레인의 빠른 발전과 도입을 촉진하는 자동차 업계에 에너지 효율적인 혁신을 제공한다는 온세미컨덕터의 노력을 입증하고 있다.

시장에 다양한 기술 및 유형의 디바이스와 모듈이 출시되고 있는 가운데, 온세미컨덕터는 모든 유형의 트랙션 인버터와 모터 애플리케이션에 대응할 수 있을 것이다. 온세미컨덕터는 앞으로도 이번 출시되는 두 가지 디바이스 대비 더 다양한 전력 수준에 맞는 디바이스를 출시할 것이다”라고 말했다.

CES 2020
미국 라스베이거스에서 열리는 세계 최대 가전전시회 ‘CES 2020’에서 온세미컨덕터 부스가 베네치안/샌즈 컨벤션 센터(Venetian/Sands Convention Center) 무라노 3302(Murrano 3302)에 마련된다. 이 곳에서는 새롭게 출시될 NVG800A75L4DSC-EVKNVH820S75L4SPB-EVKVE-Trac 평가용 키트가 시연될 예정이다. 이 외에도 자동차 전기화 섹션에서 마일드 하이브리드 전기차용 자급식 48V 로드 프로텍션 및 관리 시스템, 온세미컨덕터의 BSG/ISG 애플리케이션용 고효율, 고출력 밀도 솔루션을 탑재한 48V 시동발전기 전력단계설계 등이 시연된다. 첨단운전자보조시스템(ADAS), 자율주행, IoT, 통합 및 클라우드 파워를 포함한 CES 2020에서 진행될 시연에 대한 보다 자세한 내용은 (http:www.onsemi.com/ces2020)에서 확인할 수 있다.

시연장 투어 예약은 CESEvent@onsemi.com로 연락하면 된다.

온세미컨덕터에 대하여
에너지 효율적인 전자 제품의 혁신을 주도하고 엔지니어들이 글로벌 에너지 사용을 줄이기 위한 설계를 가능케 하는 온세미컨덕터 (나스닥: ON)는 자동차, 통신, 컴퓨터, 소비가전, 산업용, LED조명, 의료, 군사/항공, 전력 공급 애플리케이션부문에서 고객들이 독특한 설계 과제를 해결하도록 에너지 효율적인 전력/신호 관리, 로직을 비롯해 개별 소자와 맞춤 식 솔루션 포트폴리오를 다양하게 포괄적으로 제공한다. 온세미컨덕터는 즉각적이고 신뢰성 있는 세계 최고 수준의 공급망을 운영 중이며 북미, 유럽, 아시아 태평양 지역의 주요 시장에 제조 공장, 판매 대리점, 디자인 센터 네트워크를 통해 기술 서비스를 제공하고 있다. 더 자세한 정보를 알려면 https://www.onsemi.com을 방문하면 된다.

# # #

ON Semiconductor 와 ON Semiconductor 로고는 Semiconductor Components Industries, LLC의 고유상표로 등록되어있다. 여기에 언급된 모든 다른 제품과 회사명은 각 소유자들의 고유 상표이기도 하다.

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11. Miscellaneous.

11.1 Governing Law. This Agreement shall be governed by the laws of the State of New York, and applicable U.S. federal law, without giving effect to conflict of law or to choice of law principles, and excluding the 1980 United Nations Convention on Contracts for the International Sale of Goods, if applicable.

11.2 Assignment. Neither this Agreement, nor any of the rights or obligations herein, may be assigned or transferred by Licensee without the express prior written consent of ON Semiconductor, and any attempt to do so in violation of the foregoing shall be null and void. Subject to the foregoing, this Agreement shall be binding upon and inure to the benefit of the parties, their successors and assigns.

11.3 Limitations on Use. The Software is not designed, developed, licensed or provided for use in connection with any nuclear facility, or in connection with the flight, navigation or communication of aircraft or ground support equipment, or in connection with military or medical equipment/applications or activities, or any other inherently dangerous or high risk equipment/applications or activities ("High Risk Use"). Licensee agrees that ON Semiconductor (and its licensors/suppliers) shall not be liable or responsible for any claims, losses, demands, costs, expenses or liabilities whatsoever arising from or in relation to any such High Risk Use of the Content, Software, Modifications or Licensee Products by Licensee or Customers.

11.4 Severability; Waiver. Any provision of this Agreement which is held to be invalid or unenforceable by a court in any jurisdiction shall, as to such jurisdiction, be severed from this Agreement and ineffective to the extent of such invalidity or unenforceability without invalidating the remaining portions hereof or affecting the validity or enforceability of such provision in any other jurisdiction. Failure by either party hereto to enforce any term of this Agreement shall not be held a waiver of such term nor prevent enforcement of such term thereafter, unless and to the extent expressly set forth in a writing signed by the party charged with such waiver.

11.5 Remedies Not Exclusive. The remedies herein are not exclusive, but rather are cumulative and in addition to all other remedies available to ON Semiconductor.

11.6 Records; Audit. Licensee agrees that it shall maintain accurate and complete records relating to its activities under Section 2.1(b)(iii) of this Agreement during the term of this Agreement. Upon reasonable advance written notice, ON Semiconductor shall have the right no more frequently than once in any 12 month period during the term of the Agreement, through an independent third party approved by Licensee in writing (such approval not to be unreasonably withheld), to examine and audit such records and Licensee's compliance with the terms of Section 2.1(b)(iii) of this Agreement. Any such audit shall not interfere with the ordinary business operations of Licensee and shall be conducted at the expense of ON Semiconductor. All reports, documents, materials and other information collected or prepared during an audit shall be deemed to be the confidential information of Licensee ("Licensee Confidential Information"), and ON Semiconductor shall protect the confidentiality of all Licensee Confidential Information; provided that, such Licensee Confidential Information shall not be disclosed to any third parties with the sole exception of the independent third party auditor approved by Licensee in writing, and its permitted use shall be restricted to the purposes of the audit rights described in this Section 11.6.

11.7 No Joint Venture, Agency, etc. Nothing in this Agreement shall be construed as creating a joint venture, agency, partnership, trust or other similar association of any kind between the parties hereto. The parties hereto are for all purposes of this Agreement independent contractors, and neither shall hold itself out as having any authority to act as an agent or partner of the other party, or in any way bind or commit the other party to any obligations.

11.8 Interpretation. In this Agreement, words importing a singular number only shall include the plural and vice versa, and section numbers and headings are for convenience of reference only and shall not affect the construction or interpretation hereof.

11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

Nothing contained in this Agreement limits a party from filing a truthful complaint, or the party's ability to communicate directly to, or otherwise participate in either: (i) any investigation or proceeding with a United States government agency alleging a securities law violation, waste, fraud, or abuse; or (ii) an investigation or proceeding that is protected under a whistleblower provision of a U.S. federal law or regulation.

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