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安森美半导体发布2011年第3季度业绩  Japanese

2011年第3季度摘要:

总收入约8.98亿美元
现金、现金等值物及短期投资8.377亿美元
收回本金额为5,300万美元的安森美半导体2.625厘的可转换优先后偿票据
日本制造厂的运营已从3月的地震和海潚中全面恢复过来

美国亚利桑那州凤凰城–2011年11月2日 –安森美半导体公司(ON Semiconductor Corporation,美国纳斯达克上市代号:ONNN))今日美国时间宣布,2011年第3季度的总收入为8.98亿美元,比2011年第2季度下跌约1%。2011年第3季度,公司录得公认会计原则净亏损为4,940万美元,或每股全面摊薄股份0.11美元。2011年第3季度公认会计原则净亏损乃由于6,540万美元的重组、资产减值及其他费用之故,主要与本公司宣布关闭日本会津制造厂,以及其他特别项目有关。特别项目的详请见附表。

2011年第3季度的非公认会计原则净收入为1.105亿美元,或按全面摊薄基准计每股0.24美元。2011年第2季度的非公认会计原则净收入为1.077亿美元,或按全面摊薄基准计每股0.23美元。此等非公认会计原则的财务指标(及本公布内所采用的其它非公认会计原则指标,例如非公认会计原则毛利率、非公认会计原则毛利及经调整EBITDA)与公司根据美国公认会计原则编制的最直接可比指标的对账,已载于附表及公司网站(https://www.onsemi.cn)。

以混合调整基础计算,安森美半导体2011年第3季度的平均售价较2011年第2季度下跌约2%。公司第3季度的公认会计原则总毛利率为29.1%。公司第3季度公认会计原则总毛利率已计入特别项目扣除净额约5,360万美元或约590个基点。公司第3季度的非公认会计原则总毛利率为35.0%。

2011年第3季度经调整EBITDA为1.699亿美元。2011年第2季度经调整EBITDA为1.698亿美元。

安森美半导体总裁兼首席执行官Keith Jackson(傑克信)说:「在第3季度,我们又一次取得强劲收入。此外,本季内,我们使用了手头上部份剩余现金,购回5,300万美元的2.625厘可转换优先后偿票据。展望第4季,因受到泰国水灾的影响,加上环球电子供应链出现库存调整,整体上对半导体行业产生负面影响,我们预期收入会继续下跌。不过,我们对长远前景仍然充满信心。」

傑克信表示:“在2011年,公司受到两次大型天灾的夹击,一次在3月,日本发生了悲惨的地震及其引致的海潚,另一次则是近期的泰国水灾。两次天灾不幸地影响了员工、他们的家人及公司的运营。虽然很多公司员工的生活受到严重影响,但庆幸他们此刻仍然安然无恙。在日本,因着各员工努力不懈,我们的生产经已从地震和海潚中全面恢复过来。不过在泰国方面,因该国水灾灾情严峻,我们仍然暂停运营,也未能进入大城府(Ayutthaya)及Bang Pa In的厂房。为配合客户的生产需`求,公司会继续谋寻方案将生产转移至安森美半导体全球制造网络内部及外部的其他工厂。在此,特别感谢各员工及生产伙伴的努力,使公司得以继续顺利生产。”

2011年第4季度展望
傑克信说:“我们相信,泰国水灾及对公司当地的制造设施的损害将会打击公司2011年第4季度的收入,使之减少约6,000万美元。三洋半导体部是是次泰国水灾的主要受影响的部门,占了收入下滑的绝大部份。此外,由于三洋半导体部门的成本属固定性质,因此我们相信,公司2011年第4季度的净收入总额将减少约4,500万美元。水灾的预期影响载于下列的指引内。不过,有关指引并未包括公司于第4季度因泰国水灾及为恢复生产投放的资源而可能产生的任何非寻常费用或额外开支。此外,我们的指引并未计及水灾对公司供应商、子承包商及客户产生的影响,而有关影响我们正持续评估中。”

傑克信表示:“现时的产品订单趋势、订货水平和估计周转水平,公司预计安森美半导体2011年第4季度的收入将约为7.4亿美元至7.8亿美元。2011年第4季订货水平相当于我们2011年第4季预期收入的约80%至85%。与2011年第3季度比较,我们预期2011年第4季度的平均售价将下降约3%。2011年第4季度非公认会计原则展望包括以股票支付的报酬支出约600万美元。”

下表概列预期受到泰国水灾影响,安森美半导体2011年第4季的收入展望预测,惟受上文所述条件所限。

泰国水灾对安森美半导体2011年第4季收入的影响
受水灾影响前的预期收入 水灾的影响 受水灾影响后的预期收入
收入 8亿美元至8.4亿美元 6,000万美元 7.4亿美元至7.8亿美元

下表概列安森美半导体2011年第4季的公认会计原则及非公认会计原则展望,并已计及泰国水灾的影响,惟受上文所述条件所限。

安森美半导体2011年第4季业务展望(已计及泰国水灾的影响)
安森美半导体公认会计原则总收入 特别项目*** 安森美半导体非公认会计原则总收入***
收入 7.4亿美元至7.8亿美元 7.4亿美元至7.8亿美元
毛利率 26% 至 28% 2,400万美元 29%至31%
运营支出 1.95亿美元至2.05亿美元 1,500万美元 1.80亿美元至1.90亿美元
净利息支出/其它支出 1,300万美元 1,300万美元
可换股票据,非现金利息支出* 900万美元 900万美元 0美元
税项 200万美元至400万美元 200万美元 400万美元至600万美
全面摊薄股数 ** 4.48亿 700万 4.55亿

* Convertible Notes, Non-cash Interest Expense are included pursuant to FASB’s Accounting Standards Codification (“ASC”) Topic 470 Debt.

** Fully diluted share count can vary for, among other things, the actual exercise of options or restricted stock units, the incremental dilutive shares from all of the company’s convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. Please refer to the table on our website for potential changes to the Fully Diluted Share Count. This table can be found on our website at https://www.onsemi.com under Investors - Investor Relations, Quarterly Results.

*** Special Items can include: amortization of intangible assets, amortization of acquisition-related intangibles, expensing of appraised inventory fair market value step-up, purchased in-process research and development expenses, inventory valuation adjustments, restructuring, asset impairments and other, net, goodwill impairment charges, gains and losses on debt prepayment, income tax adjustments to approximate cash taxes, non-cash interest expense, their related tax effects and certain other special items as appropriate.

**** Regulation G and other provisions of the securities laws regulate the use of financial measures that are not prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that – when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases – provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies’ non-GAAP financial measures, even if they have similar names.

FINANCIALS

TELECONFERENCE
ON Semiconductor will host a conference call for the financial community at 5:00 p.m. Eastern Time (ET) on November 2, 2011, to discuss this announcement and ON Semiconductor’s results for the third quarter of 2011. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at https://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 546-9664 (U.S./Canada) or (973) 935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 21468735. Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through November 9, 2011. To listen to the teleconference replay, call (855) 859-2056 (U.S./Canada) or (404) 537-3406 (International). You will be required to provide the Conference ID Number – which is 21468735.

请关注官方微博@安森美半导体

关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ON)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。安森美半导体领先于供应基于半导体的方案,提供全面的高能效电源管理、模拟、传感器逻辑、时序、互通互联、分立、系统级芯片(SoC)及定制器件阵容。公司的产品帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,一套强有力的守法和道德规范计划,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问https://www.onsemi.cn

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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。

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ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its website in this news release, information on the website is not to be incorporated herein.

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. These forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on information available to us as of the date of this release, our current expectations, forecasts and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are the uncertainty surrounding natural disasters, including the ongoing impact of the flood in Thailand, including supply chain uncertainty, availability of raw materials, electricity, gas and water, availability of finished goods inventory, the level of damage to the buildings and equipment and our books and financial and corporate records and data, our ability to reopen the facilities, the length of down-time for operations, labor costs, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, our ability to recreate or reconstruct books and financial and corporate records and data that have been lost and to continue to prepare future financial statements in accordance with generally accepted accounting principles and other requirements, as well as any impact on our controls and procedures, our ability to collect on insurance claims and the timing thereof, the fact that the timing of events could differ materially from those anticipated, uncertainties as to the impairment and other costs and charges including the potential for unanticipated charges not currently contemplated, our revenues and operating performance, poor economic conditions and markets (including current credit and financial conditions), effects of exchange rate fluctuations, the cyclical nature of the semiconductor industry, changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks, enforcement and protection of our intellectual property rights and related risks, availability of raw materials, electricity, gas, water and other supply chain uncertainties, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, variable demand and the aggressive pricing environment for semiconductor products, our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products, competitors’ actions including the adverse impact of competitive product announcements, pricing and gross profit pressures, loss of key customers, order cancellations or reduced bookings, changes in manufacturing yields, control of costs and expenses and realization of cost savings from restructurings and synergies, significant litigation, risks associated with decisions to expend cash reserves for various uses such as debt prepayment or acquisitions rather than to retain such cash for future needs, risks associated with acquisitions and dispositions (including from integrating and consolidating, and timely filing financial information with the Securities and Exchange Commission for, recently acquired businesses, such as SANYO Semiconductor, and difficulties encountered in accurately predicting the future financial performance of recently acquired businesses, such as SANYO Semiconductor), risks associated with our substantial leverage and restrictive covenants in our debt agreements from time to time, risks associated with our worldwide operations including foreign employment and labor matters associated with unions and collective bargaining arrangements as well as man-made and/or natural disasters such as the flooding in Thailand or the Japan earthquake and tsunami affecting our operations and finances/financials, the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally, risks and costs associated with increased and new regulation of corporate governance and disclosure standards (including pursuant to Section 404 of the Sarbanes-Oxley Act of 2002), risks related to new legal requirements and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K for the period ended December 31, 2010, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and investors could lose all or part of their investment. Readers are cautioned not to place undue reliance on forward-looking statements. These forward-looking statements should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

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