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安森美半导体发布2011年第1季度业绩  Japanese

2011年第1季度摘要:

  • 总收入约8.706亿美元 ,包括
    • 安森美半导体历史收入5.925亿美元
    • 三洋半导体的收入2.781亿美元
  • 公认会计原则每股全面摊薄净收入总额0.16美元,包括
    • 安森美半导体历史公认会计原则每股全面摊薄净收入0.15美元
    • 三洋半导体公认会计原则每股全面摊薄净收入0.01美元
  • 非公认会计原则每股全面摊薄净收入总额0.27美元,包括
    • 安森美半导体历史非公认会计原则每股全面摊薄净收入0.21美元
    • 三洋半导体非公认会计原则每股全面摊薄净收入0.06美元

美国亚利桑那州菲尼克斯-2011年5月5日–安森美半导体公司(ON Semiconductor Corporation,美国纳斯达克上市代号:ONNN))今日美国时间宣布,2011年第1季度的总收入为8.706亿美元,比2010年第4季度上升超过50%。如先前公布,公司于2011年1月1日完成收购三洋半导体。2011年第1季度,公司录得公认会计原则净收入为7,480万美元,或每股全面摊薄股份0.16美元。2011年第1季度公认会计原则净收入已计入特别项目扣除净额4,640万美元,或每股全面摊薄股份0.10美元。于2010年第4季度,公司录得公认会计原则净收入为6,100万美元,或每股全面摊薄股份0.14美元。有关进一步资料,包括三洋半导体2011年第1季度的未经审核营运业绩详情,载于随附的财务表。

日本地震和海潚使产量下跌及开支增加,对2011年第1季度的业绩产生不利影响。虽然生产曾中断,但日本在3月11日发生的地震和海潚仅对公司的日本制造厂造成有限的损毁。虽然收入符合公司在2011年2月3日发出的原先指引,但我们现时估计,在2011年第1季度,生产中断对净收入构成的负面影响约为1,000万美元。公司全面稳定及恢复日本制造厂的营运进展良好。安森美半导体在日本设有六座生产设施,其中五座已恢复全面产能,第六座也迈向全面产能。

2011年第1季度的非公认会计原则净收入为1.212亿美元,或按全面摊薄基准计每股0.27美元,且已计入三洋半导体按全面摊薄基准计的非公认会计原则每股约0.06美元。2010年第4季度的非公认会计原则净收入为9,920万美元,或按全面摊薄基准计每股0.22美元。此等非公认会计原则的财务指标(及本公布内所采用的其它非公认会计原则指标,例如非公认会计原则毛利率、非公认会计原则毛利及经调整EBITDA)与公司根据美国公认会计原则编制的最直接可比指标的对账,已载于附表及公司网站(https://www.onsemi.cn/)。

以混合调整基础计算,安森美半导体2011年第1季度的历史平均售价(不包括三洋半导体)与2010年第4季度相约。公司第1季度的公认会计原则总毛利率为27.8%。公司第1季度公认会计原则总毛利率已计入特别项目扣除净额约7,090万美元或约820个基点。公司第1季度的非公认会计原则总毛利率为36.0%。

2011年第1季度经调整EBITDA为1.673亿美元。2010年第4季度经调整EBITDA为1.454亿美元。

安森美半导体总裁兼首席执行官Keith Jackson(傑克信)说:”随着收购三洋半导体,安森美半导体在2011年第1季度持续变革。在1月,公司完成收购三洋半导体,就第1季度的业务营运而言,三洋半导体为公司带来正面的盈利贡献。该交易扩大了我们的产品组合,在微控制器及定制专用集成电路至集成功率模块及电机控制器等领域增添实力。此外,我们在2月完成收购赛普拉斯半导体公司(Cypress Semiconductor Corporation)CMOS 图像传感器业务部门,使安森美半导体成为超高速CMOS 图像传感器的领先供应商。”

Jackson表示:“我们预期,与2011年第1季度比较,2011年第2季度的公司总收入中位数将轻微上升,收入、毛利及盈利将可能受到日本地震和海潚导致的供应鍊中断、产量下跌及开支增加的不利影响。根据现时的评估,我们相信地震和海潚可能对2011年第2季度的公司总销售额带来的负面影响约为5,000万美元,对毛利和收入带来的负面影响则超过3,000万美元。预期影响已载于下面的指引内。就长远而言,我们相信在日本准备就绪,会有发展,因日本正从3月11日的灾难中重建。”

2011年第二季展望
Jackson说:”2011年第2季的展望包括三洋半导体的业绩。按现时的产品订单趋势、订货水平和估计周转水平,公司预计安森美半导体2011年第2季的收入将约为8.60亿美元至9.00亿美元。2011年第2季未完成订单水平相当于我们对2011年第2季的预期收入的90%以上。与2011年第1季比较,我们预期2011年第2季的平均售价将持平或下降约1%。2011年第2季度非公认会计原则展望包括以股票支付的报酬支出约1,400万美元。”

下表概列安森美半导体2011年第2季的公认会计原则及非公认会计原则展望。

安森美半导体2011年第2季业务展望
  安森美半导体公认会计原则总收入 特别项目*** 安森美半导体非公认会计原则总收入***
收入 8.60亿美元至9.00亿美元   8.60亿美元至9.00亿美元
毛利率 31% 至 33% 4,500万美元 36%至38%
运营支出 1.98亿美元至2.08亿美元 2,000万美元 1.78亿美元至1.88亿美元
净利息支出/其它支出 1,200万美元   1,200万美元
可换股票据,非现金利息支出* 900万美元 900万美元 0美元
税项 800万美元至1,000万美元 100万美元 700万美元至900万美元
全面摊薄股数 ** 4.60亿   4.60亿

除过去对安森美半导体的一般预测(不包括三洋半导体的预期业绩)外,我们预期三洋半导体将使上述安森美的收入预测增加约2.60亿美元至2.85亿美元。我们现时预期,三洋半导体业务将于2011年第1季因购并(其中包括会计及收购相关成本)而出现公认会计原则经营亏损,但预期三洋半导体业务会产生非公认会计原则经营利润,幅度在其2011年第1季销售额的零至百分之五。鉴于交易已于近期完成,我们仍待最终落实与交易相关的购并会计处理。我们于日后会提供有关三洋半导体财务状况的更多详情。***
*可换股票据,非现金利息支出乃计入财务会计准则委员会(FASB)颁布的会计准则汇编(ASC)第470项债务。
**全面摊薄股份数目可因下列事项而变动,其中包括实际行使购股权或受限制股份单位、公司所有可换股高级次级票据产生的摊薄股份增加,及回购或发行股份或出售库存股份。有关全面摊薄股份数目的潜在变动详情,请参阅公司网站www.onsemi.cn上的图表。
***特别项目包括:重组、资产减值及其它净额;评定存货公平市值(FMV)的支出有所增加;无形资产摊销;商誉减值;所得税调整至与现金税项相若;非现金利息支出及若干其它所需特别项目。
**** G规例及其它证券法的法规规定了并非按公认会计原则编制的财务计量的用途。我们认为,此等非公认会计原则计量可为投资者提供重要的补充资料。我们利用此等计量连同公认会计原则计量作内部管理用途,并作为评估期间与期间比较数据的方式。然而,我们并不而阁下也不应全然依赖非公认会计原则计量作为业绩表现的衡量基准。我们认为,非公认会计原则财务计量是反映我们业务运营的特点的另一方式,当连同公认会计原则业绩及我们同时发布的与相应公认会计原则财务计量的对账一并采纳时,可提供影响我们业务的因素及趋势更为完整的情况。由于非公认会计原则财务计量并未标准化,故可能无法将此等财务计量与其它公司的非公认会计原则财务计量相比较(甚至在项目名称相同的情况下,亦无法比较)。

FINANCIALS

TELECONFERENCE
ON Semiconductor will host a conference call for the financial community at 5:30 a.m. Pacific Time (PDT) on May 5, 2011 to discuss this announcement and ON Semiconductor’s results for the first quarter of 2011. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at https://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 546-9664 (U.S./Canada) or (973) 935-8144 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 63850124. Approximately one hour following the live broadcast, the company will provide a dial-in replay that will continue to be available through May 12, 2011. To listen to the teleconference replay, call (800) 642-1687 (U.S./Canada) or (706) 645-9291 (International). You will be required to provide the Conference ID Number – which is 63850124.

请关注官方微博@安森美半导体

关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ON)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。安森美半导体领先于供应基于半导体的方案,提供全面的高能效电源管理、模拟、传感器逻辑、时序、互通互联、分立、系统级芯片(SoC)及定制器件阵容。公司的产品帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,一套强有力的守法和道德规范计划,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问https://www.onsemi.cn

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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. These forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on information available to us as of the date of this release, our current expectations, forecasts and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are our revenues and operating performance, poor economic conditions and markets (including current credit and financial conditions), effects of exchange rate fluctuations, the cyclical nature of the semiconductor industry, changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks, enforcement and protection of our intellectual property rights and related risks, availability of raw materials, electricity, gas, water and other supply chain uncertainties, our ability to effectively shift production to other facilities in order to maintain supply continuity for our customers, variable demand and the aggressive pricing environment for semiconductor products, our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products, competitors’ actions including the adverse impact of competitive product announcements, pricing and gross profit pressures, loss of key customers, order cancellations or reduced bookings, changes in manufacturing yields, control of costs and expenses and realization of cost savings from restructurings and synergies, significant litigation, risks associated with decisions to expend cash reserves for various uses such as debt prepayment or acquisitions rather than to retain such cash for future needs, risks associated with acquisitions and dispositions (including from integrating and consolidating, and timely filing financial information with the Securities and Exchange Commission - for, recently acquired businesses, such as SANYO Semiconductor, and difficulties encountered in accurately predicting the future financial performance of recently acquired businesses, such as SANYO Semiconductor), risks associated with our substantial leverage and restrictive covenants in our debt agreements from time to time, risks associated with our worldwide operations including foreign employment and labor matters associated with unions and collective bargaining arrangements as well as natural disasters like the Japan earthquake and tsunami affecting our operations and finances/financials, the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally, risks and costs associated with increased and new regulation of corporate governance and disclosure standards (including pursuant to Section 404 of the Sarbanes-Oxley Act of 2002), risks related to new legal requirements and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K for the period ended December 31, 2010, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and investors could lose all or part of their investment. Readers are cautioned not to place undue reliance on forward-looking statements. These forward-looking statements should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

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