Material Composition

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10 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach Epoxy			Die Attach Tape					Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Formaldehyde, polymer with amiline [%]	Amines, C36-alkylenedi-, polymers with 5,5'-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis[1,3-isobenzofurandione], maleated [%]	Bisphenol A, epichlorohydrin polymer [%]	Silver (Ag) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	40216-08-8	proprietary data	7631-86-9	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-31-5	7440-66-6	7440-47-3	7440-50-8	n/a	proprietary data	1344-28-1	n/a	67784-74-1	1224691-98-8	68610-41-3	7440-22-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCV6323	NCP6323DMTAATBG	Active	Y		8			0.5	2	86.5	3	3.72	1	0.25	0.22	0.25	98.28	5.53	65	35	0.14						100	0.21	100	0.76	100	0.18	10.54
NCV6323	NCV6323BMTAATBG	Active	Y		8			0.5	2	86.5	3	3.72	1	0.25	0.22	0.25	98.28	5.53	65	35	0.14						100	0.21	100	0.76	100	0.18	10.54
NCV6323	NCV6323BMTAAWTBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323	NCV6323DMTAATBG	Active	Y		8			0.5	2	86.5	3	3.72	1	0.25	0.22	0.25	98.28	5.53	65	35	0.14						100	0.21	100	0.76	100	0.18	10.54
NCV6323	NCV6323DMTAAWTBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323F	NCV6323FELMTW10TBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323F	NCV6323FELMTW11TBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323F	NCV6323FELMTW12TBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323F	NCV6323FELMTW18TBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04
NCV6323F	NCV6323FELMTW33TBG	Active	Y	5		2.3	5	0.4	2.3	85		5.77	2	0.25	0.22	0.25	97.28	2.16				6.5	6.5	6.5	80.5	0.09	100	0.39	100	0.55	100	0.08	9.04

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.