Material Composition

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4  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Phenolic Resin
[%]
Ortho Cresol Novolac Resin
[%]
Epoxy Phenol Resin
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Epoxy resin
[%]
Ethylene dimethacrylate
[%]
Silver (Ag)
[%]
Epoxy resins
[%]
Phenolic Resin
[%]
Inorganic filler
[%]
Dicyandiamine
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data 29690-82-2 proprietary data 1333-86-4 60676-86-0 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a proprietary data 97-90-5 7440-22-4 129915-35-1 proprietary data proprietary data 461-58-5 9003-36-5 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
TLV272 NCV272DMR2G Active  Y   Download xls Download xml Download xml Download xml     5.00   2.00   5.00   0.50   87.50   15.2200   2.50   0.10   2.40   95.00      14.2600   2.50      84.50      2.50   2.50   0.50   7.50   0.1300   100.00   0.3800   100.00   0.4300   100.00   0.3000   30.7200 
TLV272 NCV272DR2G Active  Y           No data available
TLV272 TLV272DMR2G Active  Y   Download xls Download xml Download xml Download xml     5.00   2.00   5.00   0.50   87.50   14.9600   2.50   0.10   2.40   95.00      14.2600         75.00   25.00               0.9100   100.00   0.3800   100.00   0.3100   100.00   0.3000   31.1200 
TLV272 TLV272DR2G Active  Y   Download xls Download xml Download xml Download xml  5.00   2.00   2.50      0.50   90.00   29.4800   2.00   0.12   2.35   95.50   0.03   37.6100   10.00   5.00   80.00               5.00   0.2000   100.00   1.8900   100.00   0.4300   100.00   0.1000   69.7100 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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