Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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12 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame							Die Attach														Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Ethylene dimethacrylate [%]	Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]	2,2'-[[2-(oxiranylmethoxy)-1,3-phenylene]bis(methylene)]bisoxirane [%]	4-Methyl-2-Phenyl-1H-Imidazole [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Phenolic Resin [%]	Inorganic filler [%]	Dicyandiamine [%]	Formaldehyde Polymer [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-66-6	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	97-90-5	68475-94-5	13561-08-5	827-43-0	7440-22-4	129915-35-1	54208-63-8	proprietary data	proprietary data	461-58-5	9003-36-5	9003-35-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCS20032	NCS20032DMR2G	Active	Y	5.00	5.00	2.00		0.50		87.50		14.9600	2.50	0.10		2.40	95.00		14.2600	2.50					84.50			2.50	2.50	0.50	7.50		0.9100	100.00	0.3800	100.00	0.3100	100.00	0.3000	31.1200
NCS20032	NCS20032DR2G	Active	Y	5.00	5.00	2.00		0.50		87.50		28.5800	2.10	0.20		2.50	95.20		37.6100						75.00	25.00							2.4000	100.00	1.8900	100.00	1.3300	100.00	0.1900	72.0000
NCS20032	NCS20032DTBR2G	Active	Y				10.50			89.50		9.5000				1.90	98.10		10.3800						75.00	25.00							0.6600	100.00	1.0600	100.00	1.0000	100.00	0.1000	22.7000
NCS20034	NCS20034DR2G	Active	Y	5.00	2.00	2.50		0.50		90.00		43.9300	1.20	0.12		2.35	96.30	0.03	69.6200	10.00	5.00				80.00						5.00		0.1800	100.00	3.2700	100.00	0.4800	100.00	0.1200	117.6000
NCS2003	NCS2003ASN2T1G	Active	Y	5.00	5.00	2.00		0.50		87.50		7.3400	1.22	0.12		2.35	96.28	0.03	5.7800						80.00		20.00						0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800
NCS2003	NCS2003SN2T1G	Active	Y	5.00	5.00	2.00		0.50		87.50		7.3400	1.22	0.12		2.35	96.28	0.03	5.7800	30.00		30.00	30.00	9.00								1.00	0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800
NCS2003	NCS2003XV53T2G	Last Shipments	Y			10.00		0.50	14.50	65.00	10.00	1.4000			40.50	55.50	4.00		1.2200															100.00	0.0030	100.00	0.0300	100.00	0.0500	2.7030
NCS20032	NCV20032DMR2G	Active	Y	5.00	5.00	2.00		0.50		87.50		14.9600	2.50	0.10		2.40	95.00		14.2600						75.00	25.00							0.9100	100.00	0.3800	100.00	0.3100	100.00	0.3000	31.1200
NCS20032	NCV20032DR2G	Active	Y	5.00	5.00	2.00		0.50		87.50		28.5800	2.10	0.20		2.50	95.20		37.6100						75.00	25.00							2.4000	100.00	1.8900	100.00	1.3300	100.00	0.1900	72.0000
NCS20032	NCV20032DTBR2G	Active	Y				10.50			89.50		9.5000				1.90	98.10		10.3800						75.00	25.00							0.6600	100.00	1.0600	100.00	1.0000	100.00	0.1000	22.7000
NCS20034	NCV20034DR2G	Active	Y	5.00	2.00	2.50		0.50		90.00		43.4300	1.10	0.20		2.60	96.10		69.6200						75.00	25.00							4.4400	100.00	3.2700	100.00	0.9800	100.00	0.3100	122.0500
NCS2003	NCV2003SN2T1G	Active	Y	5.00	5.00	2.00		0.50		87.50		7.3400	1.22	0.12		2.35	96.28	0.03	5.7800	30.00		30.00	30.00	9.00								1.00	0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices