Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame							Die Attach					Plating		Die		Wire Bond - Au		TOTAL
				Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	129915-35-1	7440-22-4	54208-63-8	1344-28-1	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCS2001	NCS2001SN1T1G	Active	Y	5.00	2.00	5.00	0.50	87.50	7.3400	1.22	0.12		2.35	96.28	0.03	5.7800		80.00	20.00		0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800
NCS2001	NCS2001SN2T1G	Active	Y	5.00	2.00	5.00	0.50	87.50	7.3400	1.22	0.12		2.35	96.28	0.03	5.7800		80.00	20.00		0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800
NCS2001	NCS2001SQ1T2G	Last Shipments	Y	5.00	2.00	5.00	0.50	87.50	3.9000	2.00		36.30	50.20	11.50		1.9200	65.00			35.00	0.1200	100.00	0.0500	100.00	0.1900	100.00	0.0200	6.2000
NCS2001	NCS2001SQ2T2G	Active	Y	5.00	2.00	5.00	0.50	87.50	3.9000	2.00		36.30	50.20	11.50		1.9200	65.00			35.00	0.1200	100.00	0.0500	100.00	0.1900	100.00	0.0200	6.2000
NCS2001	NCV2001SN2T1G	Active	Y	5.00	2.00	5.00	0.50	87.50	7.3400	1.22	0.12		2.35	96.28	0.03	5.7800		80.00	20.00		0.1100	100.00	0.3900	100.00	0.4200	100.00	0.0400	14.0800
NCS2001	NCV2001SQ2T2G	Active	Y	5.00	2.00	5.00	0.50	87.50	3.9000	2.00		36.30	50.20	11.50		1.9200	65.00			35.00	0.1200	100.00	0.0500	100.00	0.1900	100.00	0.0200	6.2000

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices