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Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Sort by entry order
Search OPNs only
          Download:  Download xls  Excel 

Use~for the exact search match (i.e. ~NTS2101PT1).

2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Brominated epoxy resin
[%]
Phenolic Resin
[%]
Epoxy Phenol Resin
[%]
Antimony Trioxide (Sb2O3)
[%]
Fused Silica (SiO2)
[%]
Ortho Cresol Novolac Resin
[%]
Weight
[mg]
Silver (Ag)
[%]
Mangnesium (Mg)
[%]
Silicon (Si)
[%]
Nickel (Ni)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silver (Ag)
[%]
Epoxy resins
[%]
Weight
[mg]
Lead (Pb)
[%]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data proprietary data 1309-64-4 60676-86-0 29690-82-2 n/a 7440-22-4 7439-95-4 7440-21-3 7440-02-0 7440-50-8 n/a 7440-22-4 129915-35-1 n/a 7439-92-1 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
NCP5318 NCP5318FTR2 Obsolete      Download xls Download xml Download xml Download xml  2.00   7.10      2.50   74.20   14.20   114.2400   11.60            88.40   49.9900   75.00   25.00   3.1900   20.00   80.00   6.7000   100.00   0.3300   100.00   0.6500   175.1000 
NCP5318 NCP5318FTR2G Obsolete  Y   Download xls Download xml Download xml Download xml        10.50      89.50      114.2400   0.30   0.10   0.70   3.00   95.90   49.9900   75.00   25.00   3.1900      100.00   6.7000   100.00   0.3300   100.00   0.6500   175.1000 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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