Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Download xls

Excel
Use~for the exact search match (i.e. ~NTS2101PT1).

6  Non-hybrid  devices found

Non-hybrid devices

Page size:
1 - 6 of 6 
Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Cu   TOTAL 
Epoxy resin
[%] 		Phenolic Resin
[%] 		Ortho Cresol Novolac Resin
[%] 		Carbon Black (C)
[%] 		Fused Silica (SiO2)
[%] 		Weight
[mg] 		Silver (Ag)
[%] 		Zinc (Zn)
[%] 		Iron (Fe)
[%] 		Copper (Cu)
[%] 		Phosphorus (P)
[%] 		Weight
[mg] 		Epoxy resin
[%] 		Silver (Ag)
[%] 		Formaldehyde Polymer
[%] 		Weight
[mg] 		Tin (Sn)
[%] 		Weight
[mg] 		Silicon (Si)
[%] 		Weight
[mg] 		Copper (Cu)
[%] 		Weight
[mg] 		Weight
[mg]
proprietary data proprietary data 29690-82-2 1333-86-4 60676-86-0 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a proprietary data 7440-22-4 9003-36-5 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-50-8 n/a n/a
NCP1200 NCP1200D100R2G Last Shipments  Y   Download xls Download xml Download xml Download xml  5   5   2   0.5   87.5   28.58   0.6   0.12   2.35   96.9   0.03   37.61   10   80   10   2.4   100   1.89   100   1.33   100   0.04   71.85 
NCP1200 NCP1200D40R2G Last Shipments  Y   Download xls Download xml Download xml Download xml  5   5   2   0.5   87.5   28.58   0.6   0.12   2.35   96.9   0.03   37.61   10   80   10   2.4   100   1.89   100   1.33   100   0.04   71.85 
NCP1200 NCP1200D60R2G Obsolete  Y           No data available
NCP1200 NCP1200P100G Obsolete  Y           No data available
NCP1200 NCP1200P40G Obsolete  Y           No data available
NCP1200 NCP1200P60G Obsolete  Y           No data available
Page size:
1 - 6 of 6 

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.
Your request has been submitted for approval.
Please allow 2-5 business days for a response.
You will receive an email when your request is approved.
Request for this document already exists and is waiting for approval.