Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame						Die Attach				Plating		Die		Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	9003-36-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
NCP1200	NCP1200D100R2G	Last Shipments	Y	5.00	5.00	2.00	0.50	87.50	28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	10.00	80.00	10.00	2.4000	100.00	1.8900	100.00	1.3300	100.00	0.0400	71.8500
NCP1200	NCP1200D40R2G	Last Shipments	Y	5.00	5.00	2.00	0.50	87.50	28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	10.00	80.00	10.00	2.4000	100.00	1.8900	100.00	1.3300	100.00	0.0400	71.8500
NCP1200	NCP1200D60R2G	Obsolete	Y	No data available
NCP1200	NCP1200P100G	Obsolete	Y	No data available
NCP1200	NCP1200P40G	Obsolete	Y	No data available
NCP1200	NCP1200P60G	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.