Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach						Plating		Die		Wire Bond			Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Proprietary [%]	Aluminum Trioxide (Al2O3) [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	n/a	7440-22-4	129915-35-1	proprietary data	1344-28-1	9003-36-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	7440-57-5	n/a	n/a
NCP1072	NCP1072P065G	Obsolete	Y	No data available
NCP1072	NCP1072P100BG	Active	Y	5	5	2	0.5	87.5	317.53	0.7	0.2	2.6	96.5	131.05	75	25				8.92	100	11.9	100	2.19	1	99	0.18			471.77
NCP1072	NCP1072STAT3G	Active	Y	5	5	2	0.5	87.5	59.7	1.3	0.1	2.4	96.2	37.17			10	80	10	2.37	100	7.44	100	3.3	1	99	0.01			109.99
NCP1072	NCP1072STBT3G	Active	Y	5	5	2	0.5	87.5	59.7	1.3	0.1	2.4	96.2	37.17			10	80	10	2.37	100	7.44	100	3.3				100	0.01	109.99

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.