Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Die Attach   Die   Electrode   Glass Lid /Cap   Lid Attach   Solder Ball   Substrate and Solder Mask   TOTAL 
Bisphenol A_Epichlorohydrin Polymer
[%]
Epoxy resins
[%]
Acrylic resins
[%]
Weight
[mg]
Misc.
[%]
Silicon (Si)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Titanium (Ti)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Copper (Cu)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Boron Trioxide (B2O3)
[%]
Silica Amorphous (SiO2)
[%]
Barium Monoxide (BaO)
[%]
Aluminum Trioxide (Al2O3)
[%]
Calcium Monoxide (CaO)
[%]
Arsenic Trioxide (As2O3)
[%]
Weight
[mg]
Photoinitiator
[%]
Epoxy Prepolymer
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silica crystalline
[%]
Cured Resin of Solder Mask
[%]
Bismaleimide Triazine resin
[%]
Weight
[mg]
Weight
[mg]
25068-38-6 129915-35-1 proprietary data n/a proprietary data 7440-21-3 7429-90-5 n/a 7440-32-6 7440-02-0 7440-57-5 7440-50-8 7429-90-5 n/a 1303-86-2 7631-86-9 1304-28-5 1344-28-1 1305-78-8 1327-53-3 n/a proprietary data proprietary data n/a 7440-22-4 7440-31-5 7440-50-8 n/a 14808-60-7, 14464-46-1 proprietary data proprietary data n/a n/a
MT9V115 MT9V115EBKSTC-CR Active  Y   Download xls Download xml Download xml Download xml  60.00   20.00   20.00   0.1600   0.38   98.63   0.99   1.6900   0.06   59.54   2.40   1.50   36.50   0.1800   14.20   50.00   24.00   11.00   0.10   0.70   7.9000   25.00   75.00   0.0030   7.65   90.10   2.25   0.1400   10.00   47.50   42.50   0.7200   10.7930 
MT9V115 MT9V115EBKSTC-CR1 Active  Y   Download xls Download xml Download xml Download xml  60.00   20.00   20.00   0.1600   0.38   98.63   0.99   1.6900   0.06   59.54   2.40   1.50   36.50   0.1800   14.20   50.00   24.00   11.00   0.10   0.70   7.9000   25.00   75.00   0.0030   7.65   90.10   2.25   0.1400   10.00   47.50   42.50   0.7200   10.7930 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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