Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Exempt	Mold Compound-White								Lead Frame				Die Attach Solder				Die					Case					Die Attach Solder - Solder Wafer				Heat Sink		Marking Ink						Plating-2		Terminal				TOTAL
				Polymer Resin [%]	1,2-Bis(pentabromophenyl) ethane [%]	Brominated epoxy resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Lead Bisilicate [%]	Weight [mg]	Ortho Cresol Novolac Resin [%]	Silica (SiO2) [%]	Phosphorus (P) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Silicon Dioxide (SiO2) [%]	1-Hydroxycyclohexyl phenyl ketone [%]	Padimate (C14H21NO2) [%]	2-Propenoic acid polymer [%]	Aluminum (Al) [%]	Weight [mg]	Nickel (Ni) [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Weight [mg]
				proprietary data	84852-53-9	proprietary data	1309-64-4	1333-86-4	21645-51-2	60676-86-0	n/a	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7440-21-3	7440-02-0	7440-57-5	65997-18-4	n/a	29690-82-2	14464-46-1	7723-14-0	9003-35-4	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7429-90-5	n/a	112945-52-5	947-19-3	21245-01-2	53192-18-0	7429-90-5	n/a	7440-02-0	n/a	7439-89-6	7440-50-8	7723-14-0	n/a	n/a
GBPC1206	GBPC1206	Active	7a 7c	16.67	5.83	21.67	3.33	0.83	10	41.67	6552.36	0.08	99.9	0.02	1220.4	2.5	92.5	5	18.1365	90	0.65	0.15	9.2	33.561	20.0005	70.0017	1.9976	8.0002	2949.3	2.5	92.5	5	82.8855	100	3803.24	5	5	10	65	15	0.5085	100	14.916	0.12	99.837	0.0429976	2274.69	16949.9975
GBPC1206	GBPC1206W	Active	7a 7c	16.67	5.83	21.67	3.33	0.83	10	41.67	6552.36	0.08	99.9	0.02	1220.4	2.5	92.5	5	18.1365	90	0.65	0.15	9.2	33.561	20.0005	70.0017	1.9976	8.0002	2949.3	2.5	92.5	5	82.8855	100	3803.24	5	5	10	65	15	0.5085	100	14.916	0.12	99.837	0.0429976	2274.69	16949.9975

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.