Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black					Lead Frame					Die Attach			Plating					Die			Wire Bond - Cu		Solder Ball				Under Bump Metal			TOTAL
				Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Weight [mg]	Silver (Ag) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				29690-82-2	1333-86-4	60676-86-0	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	n/a	7440-22-4	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	7429-90-5	n/a	7440-50-8	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
FAN53540	FAN53540UCX	Last Shipments	Y																			99.3063	0.693741	3.25064			4	95.5	0.5	1.21677	25.0845	74.9155	0.001184	4.468594
FAN53541	FAN53541UCX	Last Shipments	Y																			99.3063	0.693741	3.25064			4	95.5	0.5	1.21677	25.0845	74.9155	0.001184	4.468594
FAN5354	FAN5354MPX	Last Shipments	Y	5.50006	0.199926	85.7999	8.5001	26.0597	0.124561	2.34943	97.4438	0.0821573	22.6395	83	17	0.3676	1.55	3.54	92.92	1.99	0.3161	100		2.8561	100	0.43464								52.67364

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.