Material Composition

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7  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Plating   Die   Wire Bond - Au   Wire Bond - Cu   TOTAL 
Zinc borate
[%]
Phenol, polymer with 1,4-bis(methoxymethyl)benzene
[%]
Metal Hydroxide
[%]
Boron zinc hydroxide oxide
[%]
Zinc Monoxide (ZnO)
[%]
2,4,6-triamino-s-triazincompd.withs-triazine-triol
[%]
Ortho Cresol Novolac Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Chromium (Cr)
[%]
Manganese (Mn)
[%]
Silicon (Si)
[%]
Nickel (Ni)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
1332-07-6 26834-02-6 proprietary data 138265-88-0 1314-13-2 37640-57-6 29690-82-2 7631-86-9 1333-86-4 60676-86-0 29690-82-2 9003-35-4 n/a 7440-22-4 7440-47-3 7439-96-5 7440-21-3 7440-02-0 7439-89-6 7440-50-8 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a 7440-50-8 n/a n/a
BSS123 BSS123 Active  Y   Download xls Download xml Download xml Download xml  3.5   4               10      0.5   82         6.061   0.35      0.4   0.15   41.5   47.75   9.85   2.371   100   0.206   100   0.048   100   0.02         8.706 
BSS123 BSS123-F169 Obsolete  Y           No data available
BSS123L BSS123L Active  Y   Download xls Download xml Download xml Download xml        3.5            8      0.5   80      8   4.9   2.23   0.24   1.22      41.06   55.25      2.92   100   0.14   100   0.05         100   0.01   8.02 
BSS123LT BSS123LT1 Obsolete              No data available
BSS123LT BSS123LT1G Active  Y   Download xls Download xml Download xml Download xml           3   0.5   3      80   1      8   4.5   4.9               36.3   50.2   13.5   2.92   100   0.14   100   0.05         100   0.01   8.02 
BSS123LT BSS123LT7G Obsolete  Y           No data available
BSS123W BSS123W Last Shipments  Y   Download xls Download xml Download xml Download xml        3.5            8      0.5   80      8   3.685   2.31839            40.0309   57.6507      1.294   100   0.227   100   0.231   100   0.015         5.452 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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