Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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7 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black											Lead Frame								Plating		Die		Wire Bond - Au		Wire Bond - Cu		TOTAL
				Metal Hydroxide [%]	Boron zinc hydroxide oxide [%]	Zinc Monoxide (ZnO) [%]	2,4,6-triamino-s-triazincompd.withs-triazine-triol [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Chromium (Cr) [%]	Manganese (Mn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	138265-88-0	1314-13-2	37640-57-6	29690-82-2	7631-86-9	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-22-4	7440-47-3	7439-96-5	7440-21-3	7440-02-0	7439-89-6	7440-50-8	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-50-8	n/a	n/a
BSS123	BSS123	Active	Y					29		1	70			6.061	0.35		0.4	0.15	41.5	47.75	9.85	2.371	100	0.206	100	0.048	100	0.02			8.706
BSS123	BSS123-F169	Last Shipments	Y					19.9637		1.00643	79.0299			6.061	0.33741		0.80135	0.295234	41.9654	56.6006		2.371	100	0.206	100	0.048	100	0.02			8.706
BSS123L	BSS123L	Active	Y	3.5				8		0.5	80		8	4.9	2.23	0.24	1.22		41.06	55.25		2.92	100	0.14	100	0.05			100	0.01	8.02
BSS123LT	BSS123LT1	Obsolete		No data available
BSS123LT	BSS123LT1G	Active	Y		3	0.5	3		80	1		8	4.5	4.9					36.3	50.2	13.5	2.92	100	0.14	100	0.05			100	0.01	8.02
BSS123LT	BSS123LT7G	Last Shipments	Y		3	0.5	3		80	1		8	4.5	4.9					36.3	50.2	13.5	2.92	100	0.14	100	0.05			100	0.01	8.02
BSS123W	BSS123W	Last Shipments	Y	3.5				8		0.5	80		8	3.685	2.31839				40.0309	57.6507		1.294	100	0.227	100	0.231	100	0.015			5.452

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.