Material Composition

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10  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Die Attach   Die   Wire Bond - Au   Epoxy   Imaging Lens   Lid Attach   Mold Compound   Solder Ball   Solder Mask   Substrate and Solder Mask   Substrate Copper Foil   Substrate - Core Material   Substrate Plating-Au   Substrate Plating-Cu   Substrate Plating-Ni   TOTAL 
Phenolic Resin
[%]
Oxirane
[%]
1,4-Bis(2,3-epoxypropoxy)butane
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Bismaleimide Monomer
[%]
POLY(ETHYLENE GLYCOL) PHENYL ETHER ACRYLATE
[%]
2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin copolymer acrylate
[%]
Bis(4-tert-butylcyclohexyl) peroxydicarbonate
[%]
2,2-dimethyl-1,3-propanediyl dimethacrylate
[%]
2-phenoxy ethyl acrylate
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
Other Additive Agents
[%]
Ethylene Glycol
[%]
Sulfonium (Thiodi-4,1-phenylene)
[%]
Modified Silicon Dioxide (SiO2)
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Misc.
[%]
Silicon (Si)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Imidazole Addition
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
Zirconium Dioxide (ZrO2)
[%]
Silica Amorphous (SiO2)
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Titanium Dioxide (TiO2)
[%]
Sodium Monoxide (Na2O)
[%]
Zinc Monoxide (ZnO)
[%]
Antimony Trioxide (Sb2O3)
[%]
Aluminum Trioxide (Al2O3)
[%]
Potassium Monoxide (K2O)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
2-phenoxy ethyl acrylate
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
Epoxy Prepolymer
[%]
Acrylate Oligomer
[%]
Curative
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Epoxy resin
[%]
Other Additive Agents
[%]
Silica Amorphous (SiO2)
[%]
Fused Silica (SiO2)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Epoxy resin
[%]
Talc
[%]
Misc.
[%]
Carbon Black (C)
[%]
Silica Crystalline (SiO2)
[%]
Barium Sulfate (BaSO4)
[%]
Weight
[mg]
Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane
[%]
Fiber Glass (SiO2)
[%]
Zinc (Zn)
[%]
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2)
[%]
Cyanic acid (1-methylethylidene)di-4,1-phenylene ester homopolymer
[%]
Silica Amorphous (SiO2)
[%]
Chromium (Cr)
[%]
Acetophenone Derivative
[%]
Carbon Black (C)
[%]
2,4-Diethyl-9H-thioxanthen-9-one (DETX)
[%]
Aluminum Hydroxide (Al(OH)3)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Solvent Naphtha (Solvent oil)
[%]
Formaldehyde Polymer
[%]
Copper (Cu)
[%]
Barium Sulfate (BaSO4)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Epoxy resin
[%]
Boehmit (Al(OH)O)
[%]
Fiber Glass (SiO2)
[%]
Misc.
[%]
Polycarbonite
[%]
Bismaleimide Triazine resin
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Nickel (Ni)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 39817-09-9 2425-79-8 1333-86-4 60676-86-0 14808-60-7 n/a proprietary data 56641-05-5 55818-57-0 15520-11-3 1985-51-9 48145-04-6 25068-38-6 proprietary data 107-21-1 89452-37-9 67762-90-7 9003-36-5 n/a proprietary data 7440-21-3 7429-90-5 n/a 7440-57-5 n/a 68490-66-4 25068-38-6 1314-23-4 7631-86-9 9003-36-5 n/a 13463-67-7 1313-59-3 1314-13-2 1309-64-4 1344-28-1 12136-45-7 14808-60-7 n/a 48145-04-6 25068-38-6 proprietary data proprietary data proprietary data 9003-36-5 n/a proprietary data proprietary data 7631-86-9 60676-86-0 14808-60-7 n/a 7440-22-4 7440-31-5 7440-50-8 n/a proprietary data 14807-96-6 proprietary data 1333-86-4 14808-60-7 7727-43-7 n/a 105391-33-1 65997-17-3 7440-66-6 14807-96-6 25722-66-1 7631-86-9 7440-47-3 proprietary data 1333-86-4 82799-44-8 21645-51-2 7440-02-0 7440-57-5 64742-94-5 9003-36-5 7440-50-8 7727-43-7 n/a 7440-50-8 n/a proprietary data 1318-23-6 65997-17-3 proprietary data 80-05-7 proprietary data n/a 7440-57-5 n/a 7440-50-8 n/a 7440-02-0 n/a n/a
  AR0231AT4C00XUEA0-DPBR-E Obsolete  Y           No data available
  AR0231AT4C00XUEA0-DRBR-E Obsolete  Y           No data available
  AR0231AT7B00XUEA0-DPBR-E Obsolete  Y           No data available
  AR0231AT7B00XUEA0-DRBR-E Obsolete  Y           No data available
AR0231AT AR0231AT7C00XUEA0-DPBR Lifetime  Y   Download xls Download xml Download xml Download xml                       38.5   0.5   10   0.5   10   10   0.5   20            10   2.809   0.38   98.63   0.99   39.294   100   0.875   30   10   10   10   40   2.593   5.263   5.263   5.263   0.527   5.263   5.263   73.158   25.22                        24.8   3.2   10   59   3   6.45   3   96.5   0.5   58.778   54.9   3.5   2.1   0.5   2   37   8.03                                                         100   6.5   32.17   21.7   123.22999999999999   7.5   1   14.4   29.5   100   0.63   100   0.28   100   5.5   186.459 
  AR0231AT7C00XUEA0-DPBR-E Active  Y   Download xls Download xml Download xml Download xml  15   15   3   1   64   2   65.6                     37.5      1   3   21   37.5   20.8   0.38   98.63   0.99   39.79   100   0.56                     5.263   5.263   5.263   0.527   5.263   5.263   73.158   61.6   45   20   12.5   0.5   2   20   10.46                     3   96.5   0.5   56.66                        1.12   12.96   0.15   2.33   1.12   0.58   0.01   3.49   0.58   0.58   12   1.41   0.05   6.99   1.12   37.46   18.05   39.48                                                294.95 
  AR0231AT7E00XUEA0-DRBR-E Obsolete  Y           No data available
  AR0231AT7G00XPEA0-TPBR-E Obsolete  Y           No data available
  AR0231AT7R00XUEA0-DPBR-E Obsolete  Y           No data available
  AR0231AT7R00XUEA0-DRBR-E Obsolete  Y           No data available
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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