Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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10 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black									Lead Frame				Die Attach Solder				Plating		Die						Clip				TOTAL
					Epoxy resin [%]	Metal Hydroxide [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Lead (Pb) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Lead Bisilicate [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Weight [mg]
					proprietary data	proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	9003-35-4	14808-60-7	n/a	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7439-92-1	7440-21-3	7440-02-0	7440-57-5	65997-18-4	n/a	7439-89-6	7440-50-8	7723-14-0	n/a	n/a
RS1MFA	NRVHPRS1MFA	Active	Y	7a 7c				15.4504	1.03003		10.3003	73.2193	6.94164	0.1	99.87	0.03	6.79991	2.5	92.5	5	4.11996	100	0.20007		90	0.65	0.15	9.2	0.72998					18.79156
NRVS1MFL	NRVS1MFL	Active	Y	7a 7c	5		2	2.5	0.5	90			6.292	0.1	99.87	0.03	5.584	2.5	92.5	5	0.408	100	0.199		90	0.65	0.15	9.2	0.997		100		1.52	15.0
US1MFA	NRVUS1MFA	Active	Y	7a 7c				15.4504	1.03003		10.3003	73.2193	6.94164	0.1	99.87	0.03	6.79991	2.5	92.5	5	4.11996	100	0.20007		90	0.65	0.15	9.2	0.72998					18.79156
RS1M	RS1M	Active	Y	7a 7c		3.5		8	0.5	80	8		36.69	0.12	99.85	0.03	27.5903	2.5	92.5	5	2.25	100	0.6057	4.8	93.8	0.9	0.5		0.764					67.9
RS1MFA	RS1MFA	Active	Y	7a 7c				15.4504	1.03003		10.3003	73.2193	6.94164	0.1	99.87	0.03	6.79991	2.5	92.5	5	4.11996	100	0.20007		90	0.65	0.15	9.2	0.72998					18.79156
RS1MFP	RS1MFP	Active	Y	7a 7c				10.05	0.5	85.45	4		5.7288	0.1	99.87	0.03	12.3086	2.5	92.5	5	0.41096	100	2.0E-4		90	0.65	0.15	9.2	2.0218	0.100008	99.87	0.0300023	1.3299	21.80026
S1M	S1M	Active	Y	7a 7c		3.5		8	0.5	80	8		36.69	0.12	99.85	0.03	27.5903	2.5	92.5	5	2.25	100	0.6057		90	0.65	0.15	9.2	0.764					67.9
S1MFL	S1MFL	Active	Y	7a 7c	5		2	2.5	0.5	90			6.292	0.1	99.87	0.03	5.584	2.5	92.5	5	0.408	100	0.199		90	0.65	0.15	9.2	0.997		100		1.52	15.0
S1MFP	S1MFP	Active	Y	7a 7c				10.05	0.5	85.45	4		5.7288	0.1	99.87	0.03	12.3086	2.5	92.5	5	0.41096	100	2.0E-4		90	0.65	0.15	9.2	2.0218	0.100008	99.87	0.0300023	1.3299	21.80026
US1MFA	US1MFA	Active	Y	7a 7c				15.4504	1.03003		10.3003	73.2193	6.94164	0.1	99.87	0.03	6.79991	2.5	92.5	5	4.11996	100	0.20007		90	0.65	0.15	9.2	0.72998					18.79156

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.