Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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8 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach						Die Attach Epoxy			Die Attach Tape						Plating					Die		Wire Bond				Wire Bond - Au		TOTAL
				Epoxy resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]	2,2'-[[2-(oxiranylmethoxy)-1,3-phenylene]bis(methylene)]bisoxirane [%]	4-Methyl-2-Phenyl-1H-Imidazole [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Epoxy resin [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Oxirane, (chloromethyl)-, homopolymer [%]	2-Propenoic acid, 2-methyl-, polymer with butyl 2-propenoate and methyl 2-methyl-2-propenoate [%]	Proprietary [%]	Silica Amorphous (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	40216-08-8	proprietary data	29690-82-2	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68475-94-5	13561-08-5	827-43-0	9003-35-4	n/a	proprietary data	1344-28-1	n/a	24969-06-0	25035-69-2	proprietary data	7631-86-9	9003-35-4	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-57-5	7440-50-8	n/a	7440-57-5	n/a	n/a
NL27WZ08	NL27WZ08MQ1TCG	Active	Y	No data available
NL27WZ08	NL27WZ08MU1TCG	Obsolete	Y	No data available
NL27WZ08	NL27WZ08MU1TWG	Last Shipments	Y		8.00			0.50	2.00	86.50	3.00	1.9200		0.10	2.20	97.70		0.6900							65.00	35.00	0.1200								3.20	95.70	1.10	0.0100	100.00	0.0500	1.00		99.00	0.0200			2.8100
NL27WZ08	NL27WZ08MU2TCG	Obsolete	Y	No data available
NL27WZ08	NL27WZ08MU3TCG	Obsolete	Y	No data available
NL27WZ08	NL27WZ08USG	Active	Y	5.00		2.00	2.50	0.50		90.00		6.5000		0.12	2.35	97.50	0.03	4.7000										15.00	15.00	10.00	45.00	15.00	0.0190		2.40	88.00	9.60	0.0900	100.00	0.1500	3.10	0.35	96.55	0.0200			11.4790
NLV27WZ08	NL27WZ08USG-L22190	Last Shipments	Y	5.00		5.00	2.00	0.50		87.50		6.5000	0.10	2.90	3.40	93.60		2.9000	30.00	30.00	30.00	9.00	1.00	0.1800										100.00				0.0800	100.00	0.0200					100.00	0.0400	9.7200
NL27WZ08	NL27WZ08USG-Q	Active	Y	5.00		5.00	2.00	0.50		87.50		6.5000		0.12	2.35	97.50	0.03	2.9000							65.00	35.00	0.1800								2.40	88.00	9.60	0.0110	100.00	0.0200	3.10	0.35	96.55	0.0200			9.6310

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.