Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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9 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black									Lead Frame								Die Attach					Plating		Die		Wire Bond - Au		Wire Bond - Cu		TOTAL
					Epoxy resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Epoxy resins [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					proprietary data	40216-08-8	proprietary data	7631-86-9	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-31-5	7440-66-6	7440-47-3	7440-02-0	7439-89-6	7440-50-8	n/a	7440-22-4	7439-92-1	129915-35-1	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-50-8	n/a	n/a
NCP57152	NCP57152DSADJR4G	Active	Y	7a	7.00		3.00	10.00	0.50		79.50		727.2500					0.30		99.70	851.2700		95.00		5.00	11.3100	100.00	27.1500	100.00	0.1900			100.00	0.7400	1,617.9100
NCP571	NCP571MN08TBG	Active	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000
NCP571	NCP571MN09TBG	Last Shipments	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000
NCP571	NCP571MN12TBG	Active	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000
NCP57152	NCV57152DSADJR4G	Active	Y	7a	7.00		3.00	10.00	0.50		79.50		727.2500					0.30		99.70	851.2700		95.00		5.00	11.3100	100.00	27.1500	100.00	0.1900			100.00	0.7400	1,617.9100
NCP57152	NCV57152MNADJTYG	Active	Y			8.00			0.50	2.00	86.50	3.00	25.5800	1.00	0.25	0.22	0.25			98.28	14.2300	75.00		25.00		0.8600	100.00	0.5700	100.00	3.2500	100.00	0.2500			44.7400
NCP571	NCV571MN09TBG	Last Shipments	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000
NCP571	NCV571MN10TBG	Active	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000
NCP571	NCV571MN12TBG	Active	Y		7.00		7.00	15.00	0.50		70.50		10.0000	27.90					1.10	71.00	6.9700	75.00		25.00		0.4500	100.00	0.7100	100.00	0.2000	100.00	1.6700			20.0000

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.