Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame							Die Attach					Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Epoxy and Phenolic Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	40216-08-8	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-31-5	7440-66-6	7440-47-3	7439-89-6	7440-50-8	n/a	proprietary data	7440-22-4	129915-35-1	9003-36-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCP51200	NCP51200AMNTXG	Active	Y			8.00	0.50	2.00	86.50	3.00	15.0000	19.70		0.10		1.50	78.70	12.4100	8.00	84.50		7.50	0.2400	100.00	0.6000	100.00	0.6400	100.00	0.9000	29.7900
	NCP51200MNTWG	Consult Sales Office	Y	No data available
NCP51200	NCP51200MNTXG	Active	Y			8.00	0.50	2.00	86.50	3.00	15.0000	1.00	0.25	0.22	0.25		98.28	12.4100	8.00	84.50		7.50	0.2400	100.00	0.6000	100.00	0.6400	100.00	0.9000	29.7900
NCP51200	NCV51200MLTXG	Active	Y	4.70	4.70		0.10		90.50		12.3900	1.00	0.25	0.22	0.25		98.28	10.6900		75.00	25.00		0.1100	100.00	0.5600	100.00	0.6400	100.00	0.2700	24.6600
NCP51200	NCV51200MNTXG	Active	Y			8.00	0.50	2.00	86.50	3.00	15.0000	19.70		0.10		1.50	78.70	12.4100		75.00	25.00		0.7900	100.00	0.6000	100.00	0.3000	100.00	0.9000	30.0000
NCP51200	NCV51200MWTXG	Active	Y	4.70	4.70		0.10		90.50		12.3900	1.00	0.25	0.22	0.25		98.28	10.6900		75.00	25.00		0.1100	100.00	0.5600	100.00	0.6400	100.00	0.2700	24.6600

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.