Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond   TOTAL 
Epoxy resin
[%] 		Phenolic Resin
[%] 		Ortho Cresol Novolac Resin
[%] 		Carbon Black (C)
[%] 		Fused Silica (SiO2)
[%] 		Weight
[mg] 		Silver (Ag)
[%] 		Zinc (Zn)
[%] 		Iron (Fe)
[%] 		Copper (Cu)
[%] 		Weight
[mg] 		Silver (Ag)
[%] 		Epoxy resins
[%] 		Weight
[mg] 		Tin (Sn)
[%] 		Weight
[mg] 		Silicon (Si)
[%] 		Weight
[mg] 		Palladium (Pd)
[%] 		Copper (Cu)
[%] 		Weight
[mg] 		Weight
[mg]
proprietary data proprietary data 29690-82-2 1333-86-4 60676-86-0 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 n/a 7440-22-4 129915-35-1 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-05-3 7440-50-8 n/a n/a
NCP1013 NCP1013AP065G Obsolete  Y           No data available
NCP1013 NCP1013AP100G Last Shipments  Y   Download xls Download xml Download xml Download xml  5   5   2   0.5   87.5   317.53   0.7   0.2   2.6   96.5   131.05   75   25   8.92   100   11.9   100   2.19   1   99   0.18   471.77 
NCP1013 NCP1013AP133G Obsolete  Y           No data available
NCP1013 NCP1013ST100T3G Obsolete  Y           No data available
NCP1013 NCP1013ST130T3G Obsolete  Y           No data available
NCP1013 NCP1013ST65T3G Obsolete  Y           No data available
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.
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