Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame						Die Attach				Plating					Die		Wire Bond			Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	29690-82-2	7631-86-9	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	7440-50-8	n/a	n/a
MC14060B	MC14060BDG	Active	Y	5		5	2		0.5	87.5	55.11	1	0.2	2.6	96.2		75.92		75	25	4.85	100				3.73	100	2.73				100	0.34	142.68
MC14060B	MC14060BDR2G	Active	Y	5		5	2		0.5	87.5	55.11	1	0.2	2.6	96.2		75.92		75	25	4.85	100				3.73	100	2.73				100	0.34	142.68
MC14060B	MC14060BDTR2G	Active	Y	5	4			10	1	80	19	0.3	0.19	2.59	96.78	0.14	20.76	23	77		1.32		7.6	91	1.4	2.12	100	2	1	99	0.2			45.4
MC14060B	NLV14060BDG	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.