Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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7 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black									Lead Frame						Die Attach				Plating				Die		Wire Bond - Al		Wire Bond - Au		TOTAL
					Phenol Resin [%]	Trimethoxysilylpropanethiol [%]	Boron zinc hydroxide oxide [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Indium (In) [%]	Silver (Ag) [%]	Lead (Pb) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
					proprietary data	4420-74-0	138265-88-0	29690-82-2	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-22-4	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-74-6	7440-22-4	7439-92-1	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-21-3	n/a	7429-90-5	n/a	7440-57-5	n/a	n/a
J211	J211	Obsolete			No data available
J211	J211-D74Z	Active			10.00				1.00	77.00	12.00		112.0000	0.01		0.10	99.86	0.03	101.0000						100.00		5.8500	100.00	0.0750			100.00	0.0760	219.0010
MJ21193	MJ21193G	Active		7a											1.00	99.00			11,138.1000	5.00	3.00	92.00	795.5600	3.00	96.50	0.50	38.8300	100.00	18.3000	100.00	0.3820			11,991.1720
MJ21194	MJ21194G	Active		7a											1.00	99.00			11,138.1000	5.00	3.00	92.00	795.5600	3.00	96.50	0.50	38.8300	100.00	18.3000	100.00	0.3820			11,991.1720
MJ21195	MJ21195G	Active		7a											1.00	99.00			11,138.1000	5.00	3.00	92.00	795.5600	3.00	96.50	0.50	38.8300	100.00	18.3000	100.00	0.3820			11,991.1720
MJ21196	MJ21196G	Active		7a											1.00	99.00			11,138.1000	5.00	3.00	92.00	795.5600	3.00	96.50	0.50	38.8300	100.00	18.3000	100.00	0.3820			11,991.1720
MMBFJ211	MMBFJ211	Active	Y			0.50	5.00	10.00	0.50	79.00		5.00	6.0610	2.00	36.30	50.20	11.50		2.3710						100.00		0.2060	100.00	0.0480			100.00	0.0200	8.7060

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.