Material Composition

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4  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Plating   Die   Wire Bond - Cu   TOTAL 
Boron zinc hydroxide oxide
[%]
Zinc Monoxide (ZnO)
[%]
2,4,6-triamino-s-triazincompd.withs-triazine-triol
[%]
Ortho Cresol Novolac Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Aluminum Hydroxide (Al(OH)3)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Nickel (Ni)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
138265-88-0 1314-13-2 37640-57-6 29690-82-2 7631-86-9 1333-86-4 21645-51-2 60676-86-0 29690-82-2 9003-35-4 n/a 7440-22-4 7440-02-0 7439-89-6 7440-50-8 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-50-8 n/a n/a
ESD9L ESD9L3.3ST5G Active  Y   Download xls Download xml Download xml Download xml  3.00   0.50   3.00      80.00   1.00         8.00   4.50   0.1900   17.80   30.90   42.70   8.60   0.2100   100.00   0.0100   100.00   0.0300   100.00   0.0030   0.4430 
ESD9L ESD9L5.0ST5G Active  Y   Download xls Download xml Download xml Download xml           10.00      0.50   14.50   65.00      10.00   0.1900   17.80   30.90   42.70   8.60   0.2100   100.00   0.0100   100.00   0.0300   100.00   0.0030   0.4430 
ESD9L SESD9L5.0ST5G Active  Y   Download xls Download xml Download xml Download xml  3.00   0.50   3.00      80.00   1.00         8.00   4.50   0.1900   17.80   30.90   42.70   8.60   0.2100   100.00   0.0100   100.00   0.0300   100.00   0.0030   0.4430 
ESD9L SZESD9L3.3ST5G Last Shipments  Y   Download xls Download xml Download xml Download xml           10.00      0.50   14.50   65.00      10.00   0.1900   17.80   30.90   42.70   8.60   0.2100   100.00   0.0100   100.00   0.0300   100.00   0.0030   0.4430 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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