Material Composition

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3  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Die Attach Epoxy   Plating   Die   Wire Bond - Cu   TOTAL 
Epoxy resin
[%]
Epoxy and Phenolic Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Aluminum Hydroxide (Al(OH)3)
[%]
Fused Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Zinc (Zn)
[%]
Chromium (Cr)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silver (Ag)
[%]
Epoxy resins
[%]
Weight
[mg]
Epoxy resin
[%]
Cumene hydroperoxide
[%]
Diethylene glycol monoethyl ether acetate
[%]
Silver (Ag)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 40216-08-8 7631-86-9 1333-86-4 21645-51-2 60676-86-0 9003-35-4 n/a 7440-22-4 7440-31-5 7440-66-6 7440-47-3 7440-50-8 n/a 7440-22-4 129915-35-1 n/a proprietary data 80-15-9 112-15-2 7440-22-4 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-50-8 n/a n/a
NCP81151B NCP81151BMNTBG Active  Y   Download xls Download xml Download xml Download xml  4.70      10.00   0.10      80.50   4.70   2.6900   1.00   0.25   0.22   0.25   98.28   3.5100   75.00   25.00   0.0900                  100.00   0.2900   100.00   0.4900   100.00   0.0600   7.1300 
NCP81151 NCP81151MNTAG Obsolete  Y           No data available
NCP81151 NCP81151MNTBG Active  Y   Download xls Download xml Download xml Download xml     8.00      0.50   2.00   86.50   3.00   2.6900   1.00   0.25   0.22   0.25   98.28   3.5100            10.00   0.50   4.50   85.00   0.0900   100.00   0.2900   100.00   0.4900   100.00   0.0600   7.1300 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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