Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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8 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black								Lead Frame			Die Attach			Plating		Die		Wire Bond - Cu		TOTAL
					Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					proprietary data	proprietary data	29690-82-2	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-02-0	7440-50-8	n/a	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
MC33166	MC33166D2TG	Active	Y	7a		5.00	2.00	5.00		0.50	87.50	727.2536	0.30	99.70	851.2700	95.00	5.00	11.3100	100.00	27.1500	100.00	0.1900	100.00	0.7400	1,617.9136
MC33166	MC33166D2TR4G	Active	Y	7a		5.00	2.00	5.00		0.50	87.50	727.2536	0.30	99.70	851.2700	95.00	5.00	11.3100	100.00	27.1500	100.00	0.1900	100.00	0.7400	1,617.9136
MC33166	MC33166TG	Lifetime	Y	7a	7.00	7.00			15.00	0.50	70.50	543.9000		100.00	1,297.6400	95.00	5.00	82.8300	100.00	31.1300	100.00	3.5500	100.00	1.3700	1,960.4200
MC33166	MC33166TVG	Active	Y	7a	7.00	7.00			15.00	0.50	70.50	543.9000		100.00	1,297.6400	95.00	5.00	82.8300	100.00	31.1300	100.00	3.5500	100.00	1.3700	1,960.4200
MC33166	MC34166D2TR4G	Active	Y	7a		5.00	2.00	5.00		0.50	87.50	727.2536	0.30	99.70	851.2700	95.00	5.00	11.3100	100.00	27.1500	100.00	0.1900	100.00	0.7400	1,617.9136
MC33166	MC34166TG	Lifetime	Y	7a	7.00	7.00			15.00	0.50	70.50	543.9000		100.00	1,297.6400	95.00	5.00	82.8300	100.00	31.1300	100.00	3.5500	100.00	1.3700	1,960.4200
MC33166	MC34166THG	Lifetime	Y	7a	7.00	7.00			15.00	0.50	70.50	543.9000		100.00	1,299.1300	95.00	5.00	82.9200	100.00	31.1300	100.00	3.5500	100.00	1.3700	1,962.0000
MC33166	MC34166TVG	Lifetime	Y	7a	7.00	7.00			15.00	0.50	70.50	543.9000		100.00	1,297.6400	95.00	5.00	82.8300	100.00	31.1300	100.00	3.5500	100.00	1.3700	1,960.4200

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices