Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol
[%]
Ortho Cresol Novolac Resin
[%]
Antimony Trioxide (Sb2O3)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Silver (Ag)
[%]
Phenolic Resin-2
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
6386-73-8 29690-82-2 1309-64-4 1333-86-4 60676-86-0 9003-35-4 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a 7440-22-4 54208-63-8 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
FAN7392 FAN7392MX Last Shipments  Y   Download xls Download xml Download xml Download xml     6      1   90   3   263.4   3.50012   0.192909   2.31633   93.8938   0.0968102   140.481   72.5   27.5   0.3512   100   13.17   100   21.16   100   0.439   439.0012 
FAN7392 FAN7392N Last Shipments  Y   Download xls Download xml Download xml Download xml  0.999899   28.5065   2.99536   0.500673   66.9976      691.07   0.500501   0.120242   2.30108   97.0483   0.029908   327.672   75   25   0.099   100   22.6   100   0.905   100   0.348   1042.694 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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