Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Die			Backside Protection Film							Solder Ball				Under Bump Metal			TOTAL
				Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Epoxy resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Acrylic resins [%]	Silica (SiO2) [%]	2,4,6-Tris[Bis(Methoxymethyl)Amino]-1,3,5-Triazine [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				7440-21-3	7429-90-5	n/a	proprietary data	29690-82-2	1333-86-4	proprietary data	14464-46-1	3089-11-0	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
FAN48610	FAN48610BUC33X	Active	Y	99.452	0.54805	1.48455		20.9303	1.86092		56.2785	20.9303	0.076286	4	95.5	0.5	0.547544	25.0853	74.9147	0.025924	2.134304
FAN48610	FAN48610BUC45X	Active	Y	99.452	0.54805	1.48455		20.9303	1.86092		56.2785	20.9303	0.076286	4	95.5	0.5	0.547544	25.0853	74.9147	0.025924	2.134304
FAN48610	FAN48610BUC50X	Active	Y	99.452	0.54805	1.48455		20.9303	1.86092		56.2785	20.9303	0.076286	4	95.5	0.5	0.547544	25.0853	74.9147	0.025924	2.134304
FAN48610	FAN48610UC50X	Active	Y	99.452	0.54805	1.1356	20.93		1.84	20.93	56.3		0.0721	4	95.5	0.5	0.5417	0.62	99.38	0.1375	1.8869

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.