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Package Drawings for  Non-Isolated Conversion (Show All)

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Document Title
Document ID/Size
Revision
5 LEAD D2PAK 936A-02 (63kB) E
8 LEAD PDIP 626-05 (51kB) P
8 PIN DFN, 4x4 488AF (44kB) C
ChipFET 1206A-03 (53kB) K
DFN 3x3x0.9mm, 0.95p 506AH (46kB) O
DFN5 5X6, 1.27P (SO 8FL) 488AA (27.3kB) N
DPAK (SINGLE GAUGE) TO-252 369C (81kB) F
DPAK (Single Gauge) / ATPAK 369AM (42kB) O
DPAK / TP-FA 369AH (41kB) O
IPAK / TP 369AJ (34kB) O
PQFN34 5.0x5.5, 0.5P 483AM (183kB) A
PQFN8 5x6, 1.27P 483AR (161kB) A
SC-88/SC70-6/SOT-363 6 LEAD 419B-02 (53kB) Y
SOD-323 2 LEAD 477-02 (44kB) H
SOD-523 2 LEAD 502-01 (43kB) E
SOIC 16 LEAD 751B-05 (50kB) K
SOIC-8 Narrow Body 751-07 (53kB) AK
SOT-23 (TO-236) 318-08 (45kB) AS
TO-220 5 LEAD 314D-04 (45kB) H
TO-220 5 LEAD OFFSET 314B-05 (45kB) L
TSOP-6 318G-02 (51kB) V
TSSOP-14 WB 948G-01 (51kB) C
TSSOP-16 948F-01 (52kB) B
WDFN3 2x2x0.75 mm, 1.3 mm Pitch 506AU (41kB) A
WDFN8 3.3x3.3, 0.65P 511AB (45kB) D
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