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Reliability Data - Device MTBF/MTTF/FIT

Device: ATP405-TL-H
Equivalent to wafer fab process: TRENCH SUB

Die Related Summary Data

Product Technology

Rej

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS
TRENCH SUB 0

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

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