Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	Exempt	Mold Compound-Black						Lead Frame					Die Attach				Die Attach Epoxy					Plating		Die		Wire Bond - Al		Wire Bond - Cu		Heat Sink				Thermistor								TOTAL
				2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Weight [mg]	Weight [mg]
				6386-73-8	29690-82-2	1309-64-4	1333-86-4	60676-86-0	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	7440-57-5	n/a	1344-28-1	7440-02-0	7440-50-8	n/a	7440-22-4	7440-31-5	1313-99-1	7440-05-3	7440-02-0	1308-06-1	1317-35-7	n/a	n/a
NFL25065L4BT	NFL25065L4BT	Active	7a	1	10	1	1	87	13000	0.0340405	0.119952	99.8059	0.0400613	12303.9	2	88	10	150	3	5	85	7	14.36	100	110	100	67.6	100	34	100	1.7	39.5	1	59.5	5920	8	1.7	26	3.5	0.8	17	43	10	31611.56

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.