Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame								Die Attach				Plating		Die		Wire Bond - Au		Lead Frame plating		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Epoxy resins [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Acrylic resin [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silver (Ag) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	129915-35-1	7631-86-9	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-31-5	7440-66-6	7440-47-3	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	129915-35-1	proprietary data	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-22-4	n/a	n/a
NCV97311A	NCV97311MW33AR2G	Last Shipments	Y	4.70	4.70			0.10		90.50		34.6600	5.40		0.12		2.35	92.10	0.03	30.4000	75.00	25.00		0.2600	100.00	3.0900	100.00	5.2500	100.00	0.2300			73.8900
NCV97311A	NCV97311MW50AR2G	Active	Y			5.00	5.00	0.40	2.30	85.00	2.30	31.7600		0.25	0.22	0.25		99.28		21.9300	85.00		15.00	2.7400	100.00	2.1600	100.00	8.2200	100.00	0.4800	100.00	0.4500	67.7400

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.