Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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Use~for the exact search match (i.e. ~NTS2101PT1).

21 Non-hybrid devices found

Non-hybrid devices

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1 - 21 of 21

Base part	Part	Status	HF	Exempt	Mold Compound-Black					Lead Frame			Die Attach			Plating		Die		Wire Bond - Cu		TOTAL
					Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7440-02-0	7440-50-8	n/a	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
	NCV86601BD33R2G	Obsolete	Y		No data available
	NCV86601BDT33RKG	Obsolete	Y		No data available
	NCV86601BDT50RKG	Obsolete	Y		No data available
NCV8660	NCV86601D50R2G	Consult Sales Office	Y		No data available
NCV8660	NCV86601DT50RKG	Consult Sales Office	Y		No data available
	NCV86602BD33R2G	Obsolete	Y		No data available
	NCV86602BD50R2G	Obsolete	Y		No data available
	NCV86602BDT33RKG	Obsolete	Y		No data available
	NCV86602BDT50RKG	Obsolete	Y		No data available
NCV8660	NCV86602DT33RKG	Consult Sales Office	Y		No data available
NCV8660	NCV86602DT50RKG	Consult Sales Office	Y		No data available
	NCV86603BD33R2G	Obsolete	Y		No data available
	NCV86603BD50R2G	Obsolete	Y		No data available
	NCV86603BDT33RKG	Last Shipments	Y	7a	8	8	0.5	83.5	126.45	0.2	99.8	214.64	95	5	1.4	100	3.73	100	3.4	100	0.5	350.12
	NCV86603BDT50RKG	Obsolete	Y		No data available
NCV8660	NCV86603DT33RKG	Consult Sales Office	Y		No data available
	NCV86604BD33R2G	Obsolete	Y		No data available
	NCV86604BD50R2G	Obsolete	Y		No data available
	NCV86604BDT33RKG	Obsolete	Y		No data available
	NCV86604BDT50RKG	Obsolete	Y		No data available
NCV8660	NCV86604DT33RKG	Consult Sales Office	Y		No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.