Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

4 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 4 of 4

Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach				Plating				Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Formaldehyde Polymer [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	9003-36-5	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCV57000	NCV57000DWR2G	Active	Y	7.5	2.5	7.5	0.5	82	368.14	0.12	2.35	97.5	0.03	117	10	80	10	0.51	3.67	81.59	14.74	0.65	100	2.16	100	0.6	489.06
NCV57001	NCV57001DWR2G	Active	Y	7.5	2.5	7.5	0.5	82	368.14	0.12	2.35	97.5	0.03	117	10	80	10	0.51	3.67	81.59	14.74	0.65	100	2.16	100	0.6	489.06
NCV57001FDWR2G	NCV57001FDWR2G	Active	Y	7.5	2.5	7.5	0.5	82	368.14	0.12	2.35	97.5	0.03	117	10	80	10	0.51	3.67	81.59	14.74	0.65	100	2.16	100	0.6	489.06
NCV5700	NCV5700DR2G	Active	Y	7.5	2.5	7.5	0.5	82	94.04	0.12	2.35	97.5	0.03	53.79	10	80	10	0.25	7	81.6	11.4	0.75	100	1.58	100	0.15	150.56

Page size:

1 - 4 of 4

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.